Solid-state imaging device
An imaging device that includes a substrate, a photoelectric conversion section disposed in the substrate, an element isolation region disposed adjacent to the photoelectric conversion section, a floating diffusion electrically connected to the photoelectric conversion section, an amplification transistor having a gate electrode and an active region, and a contact section disposed on the gate electrode of the amplification transistor. The contact section overlaps the active region of the amplification transistor. The floating diffusion is electrically connected to the gate electrode of the amplification transistor via the contact section. The width of the gate electrode of the amplification transistor is larger than a width of the active region of the amplification transistor. The photoelectric conversion section includes a first type impurity, and the element isolation region includes a second type impurity having a conductivity opposite to the first type impurity.
1. An imaging device comprising:
a substrate;
a photoelectric conversion section disposed in the substrate;
an element isolation region disposed adjacent to the photoelectric conversion section;
a floating diffusion electrically connected to the photoelectric conversion section;
an amplification transistor having a gate electrode and an active region; and
a contact section disposed on the gate electrode of the amplification transistor, wherein the contact section overlaps the active region of the amplification transistor,
wherein,
the floating diffusion is electrically connected to the gate electrode of the amplification transistor via the contact section,
a width of the gate electrode of the amplification transistor is larger than a width of the active region of the amplification transistor,
the photoelectric conversion section includes a first type impurity, and
the element isolation region includes a second type impurity having a conductivity opposite to the first type impurity.
2. The imaging device according to claim 1 , wherein the second type impurity is a p-type impurity, and wherein the first type impurity is an n-type impurity.
3. The imaging device according to the claim 1 , wherein the photoelectric conversion section is configured to generate a signal charge according to an amount of incident light.
4. The imaging device according to the claim 1 , wherein the element isolation region is between the photoelectric conversion section and another photoelectric conversion section.
5. The imaging device according to the claim 1 , wherein the element isolation region includes an insulation film over the substrate and an impurity region of the second type impurity under the insulating film.
6. The imaging device according to the claim 5 , wherein the impurity region of the second type impurity has a first impurity region and a second impurity region.
7. The imaging device according to the claim 6 , wherein the first impurity region is a p+ impurity region, and wherein the second impurity region is a p impurity region.
8. The imaging device according to the claim 6 , wherein the first impurity region is a different shape from the second impurity region.
9. The imaging device according to the claim 6 , wherein the first impurity region is above the second impurity region.
10. The imaging device according to the claim 6 , wherein the second impurity region of the element isolation area is at least adjacent to a drain area of the amplifying transistor.
11. The imaging device according to the claim 1 , further comprising:
a reset transistor having a gate electrode and an active region,
wherein a width of the gate electrode of the reset transistor is larger than a width of the active region of the reset transistor.
12. The imaging device according to the claim 1 , further comprising:
a selection transistor having a gate electrode and an active region,
wherein a width of the gate electrode of the selection transistor is larger than a width of the active region of the selection transistor.