Aerosol deposition coating for semiconductor chamber components
A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.
1. A method comprising:
loading a component into a deposition chamber, wherein the component is a component of a processing chamber;
reducing a pressure of the deposition chamber below atmospheric pressure; and
depositing a coating on the component by spraying an aerosol of ceramic nanoparticles comprising a mixture of a first rare earth metal oxide, a second rare earth metal oxide and a third metal oxide onto the component at approximately room temperature, wherein the coating has a particle crystal structure and wherein:
the first rare earth metal oxide is Y 2 O 3 and the mixture comprises the Y 2 O 3 in a range of 40 mol % to less than 100 mol %;
the second rare earth metal oxide is ZrO 2 and the mixture comprises the ZrO 2 in a range of greater than 0 mol % to less than 60 mol %; and
the third metal oxide is Al 2 O 3 and the mixture comprises the Al 2 O 3 at a range of greater than 0 mol % to 40 mol %.
2. The method of claim 1 further comprising polishing the component such that a surface roughness of the component is less than about 0.2 microinch.
3. The method of claim 1 , wherein the aerosol has a velocity of greater than about 300 meters per second.
4. The method of claim 1 , wherein the aerosol further comprises a carrier gas of Nitrogen or Argon.
5. The method of claim 1 , further comprising heating the component after deposition of the coating to greater than about 1450 degrees C. for more than about 30 minutes to form a barrier layer between the component and the coating.
6. The method of claim 1 , further comprising depositing an additional coating on the component via a pressurized flow of an additional powder directed to the component in the deposition chamber at room temperature.
7. The method of claim 1 , wherein the component comprises Aluminum.
8. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 50-75 mol %;
the mixture comprises the ZrO 2 in a range of 10-30 mol %; and
the mixture comprises the Al 2 O 3 in a range of 10-30 mol %.
9. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 40 mol % to less than 100 mol %;
the mixture comprises the ZrO 2 in a range of greater than 0 mol % to less than 60 mol %; and
the mixture comprises the Al 2 O 3 in a range of greater than 0 mol % to less than 10 mol %.
10. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 40-60 mol %;
the mixture comprises the ZrO 2 in a range of greater than 30 mol % to 50 mol %; and
the mixture comprises the Al 2 O 3 in a range of 10-20 mol %.
11. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 40 mol % to less than 50 mol %;
the mixture comprises the ZrO 2 in a range of 20-40 mol %; and
the mixture comprises the Al 2 O 3 in a range of 20-40 mol %.
12. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of greater than 70 mol % to 90 mol %;
the mixture comprises the ZrO 2 in a range of greater than 0 mol % to 20 mol %; and
the mixture comprises the Al 2 O 3 in a range of 10-20 mol %.
13. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 60-80 mol %;
the mixture comprises the ZrO 2 in a range of greater than 0 mol % to 10 mol %; and
the mixture comprises the Al 2 O 3 in a range of 20-40 mol %.
14. The method of claim 1 , wherein:
the mixture comprises the Y 2 O 3 in a range of 40-60 mol %;
the mixture comprises the ZrO 2 in a range of greater than 0 mol % to 20 mol %; and
the mixture comprises the Al 2 O 3 in a range of greater than 30 mol % to 40 mol %.
15. A method comprising:
loading a component into a deposition chamber, wherein the component is a component of a processing chamber;
reducing a pressure of the deposition chamber below atmospheric pressure; and
depositing a coating on the component by spraying an aerosol of ceramic nanoparticles consisting of a mixture of a first rare earth metal oxide and a second metal oxide onto the component at approximately room temperature, wherein the coating has a particle crystal structure and wherein:
the first rare earth metal oxide is Er 2 O 3 ; and
the second metal oxide is Al 2 O 3 .
16. A method comprising:
loading a component into a deposition chamber, wherein the component is a component of a processing chamber;
reducing a pressure of the deposition chamber below atmospheric pressure; and
depositing a coating on the component by spraying an aerosol of ceramic nanoparticles consisting of a mixture of a first rare earth metal oxide and a second metal oxide onto the component at approximately room temperature, wherein the coating has a particle crystal structure and wherein:
the first rare earth metal oxide is Gd 2 O 3 ; and
the second metal oxide is Al 2 O 3 .