Anti-tamper device
A multi-layered electronic system has: a support substrate which supports at least a primary conductive track and a conductive shorting element, which are electrical isolated from one another. A security layer has at least a conductive security connection and a flexible switch element providing an electrical interruption to the conductive security track. The conductive security connection electrically engages the primary conductive track. The flexible switch element is coplanar with the conductive security connection. A dielectric substrate, to which the security layer is affixed, is secured to the support substrate. The electrical interruption of the conductive security connection is bridged by the switch element contacting the conductive shorting element under an actuation force provided from the direction of the dielectric substrate, the switch element being biased away from the conductive shorting element in the absence of the actuation force.
1. A multi-layered electronic system comprising:
a support substrate;
a primary conductive track and a conductive shorting element supported by the support substrate, the primary conductive track and conductive shorting element being in electrical isolation from one another;
a security layer including at least a conductive security connection and a flexible switch element providing an electrical interruption to the conductive security connection, the conductive security connection being in electrical engagement with the primary conductive track, and the flexible switch element being at least in part coplanar with the conductive security connection; and
a dielectric substrate on which the security layer is provided, and which is directly or indirectly secured to the support substrate;
wherein the electrical interruption of the conductive security connection is bridged by the switch element contacting the conductive shorting element under an actuation force provided from the direction of the dielectric substrate, the switch element returning to an unbiased condition out of electrical contact with the conductive shorting element in the absence of said actuation force.
2. The multi-layered electronic system of claim 1 , wherein the support substrate includes at least a printed circuit board, onto which the primary conductive track is printed.
3. The multi-layered electronic system of claim 1 , wherein the switch element comprises at least one flexible electrically conductive element, capable of being actuated into engagement with the conductive shorting element under said actuation force.
4. The multi-layered electronic system of claim 1 , wherein the dielectric substrate is at least partially elastic, the switch element being in contact with the dielectric substrate, wherein in the absence of the actuation force, the dielectric substrate biases the switch element away from the conductive shorting element upon returning to its unbiased condition.
5. The multi-layered electronic system of claim 1 , wherein an adhesive layer is provided to affix the security layer and dielectric substrate to the support substrate.
6. The multi-layered electronic system of claim 1 , wherein the electrical interruption of the conductive security connection is an air gap.
7. The multi-layered electronic system of claim 1 , wherein the conductive security connection is formed as a track following a meandering, tortuous, serpentine or zig-zagged path.
8. The multi-layered electronic system of claim 1 , wherein the security layer is integrally formed with the dielectric substrate.
9. The multi-layered electronic system of claim 1 , wherein the conductive security connection covers a majority of a lower surface of the dielectric substrate.
10. The multi-layered electronic system of claim 1 , wherein the primary conductive track is formed from copper or nickel.
11. The multi-layered electronic system of claim 1 , wherein the conductive security connection is formed from copper, nickel, silver or gold.
12. The multi-layered electronic system of claim 1 , wherein the conductive shorting element is integrally formed with the support substrate.
13. The multi-layered electronic system of claim 1 , wherein the conductive shorting element is affixed to the security layer using a non-electrically-conductive adhesive.
14. The multi-layered electronic system of claim 1 , further comprising a retaining element overlying the dielectric substrate directly above the switch element, the retaining element applying the actuation force to create physical and electrical contact between the switch element and the conductive shorting element.
15. The multi-layered electronic system of claim 14 , wherein the retaining element is a spigot.
16. An anti-tamper electronic device having a housing enclosing circuitry, wherein the circuitry of the device includes the multi-layered electronic system of claim 1 .
17. The anti-tamper electronic device of claim 16 , wherein at least the dielectric substrate is connected to the housing of the electronic device.
18. The anti-tamper electronic device of claim 16 , wherein the support substrate is integrally formed with the housing of the electronic device.
19. The anti-tamper electronic device of claim 16 , wherein a spigot is integrally formed with the housing of the electronic device to provide the actuation force required to contact the switch element with the conductive shorting element.