Device for cooling a superconducting machine
A device for cooling a superconducting machine is disclosed, including a storage vessel which receives condensed coolant and from which the coolant can be fed via a pipe to the machine, wherein the storage vessel has a storage region and an evaporator region, which is separated from the former, with a heat source which continuously has a temperature above the boiling point of the coolant. The evaporator region is connected via a curved overflow pipe to the storage region in such a way that, when a defined coolant filling level is reached in the storage region, coolant flows via the overflow pipe automatically into the evaporator region and evaporates there.
1. A device for cooling a superconducting machine, comprising:
a single storage tank having a continuous outer peripheral wall and accommodating a condensed coolant, from which the coolant is able to be supplied via a riser pipe connected to the superconducting machine, the storage vessel including
a storage region within the storage tank,
an evaporator region within the storage tank and separated from the storage region, the evaporator region including a heat source to provide a temperature continuously above the boiling temperature of the coolant, and
a curved overflow pipe connecting the evaporator region to the storage region such that, when a coolant fill level in the storage region is reached, coolant flows automatically via the overflow pipe into the evaporator region to evaporate therein.
2. The device of claim 1 , wherein the overflow pipe is curved in a U shape and includes a suction arm disposed in the storage region, an outlet arm disposed in the evaporator region and a transverse arm between the suction arm and the outlet arm.
3. The device of claim 1 , wherein an apex of the overflow pipe lies below an upper edge of a partition wall separating the storage region from the evaporator region.
4. The device of claim 3 , wherein a distance in height terms between a suction opening of the suction arm and the apex amounts to at least one centimeter.
5. The device of claim 1 , wherein, in the storage region, an overflow region is separated off by way of an overflow wall, into which coolant overflows and from which, when the fill level is reached, coolant runs via the overflow pipe into the evaporator region.
6. The device of claim 1 , wherein the heat source is a heater.
7. The device of claim 1 , wherein the heat source is a wall surface which, in an installation position, is in thermal contact with a third object having a temperature lying above the boiling temperature of the coolant.
8. The device of claim 1 , wherein a number of storage vessels are provided, pipes of the storage devices being designed as riser lines routed separately to the superconducting machine, or as riser lines which open out into a common supply line running to the superconducting machine.
9. The device of claim 8 , wherein each of the storage vessels is assigned a separate condenser device for condensing the gaseous coolant coming from the superconducting machine, or wherein each of the storage vessels are assigned a common condenser device.
10. The device of claim 1 , wherein the coolant is conveyed in the riser pipe against the force of gravity.
11. The device of claim 2 , wherein an apex of the overflow pipe lies below an upper edge of a partition wall separating the storage region from the evaporator region.
12. The device of claim 3 , wherein a distance in height terms between a suction opening of the suction arm and the apex amounts to several centimeters.
13. The device of claim 2 , wherein, in the storage region, an overflow region is separated off by way of an overflow wall, into which coolant overflows and from which, when the fill level is reached, coolant runs via the overflow pipe into the evaporator region.
14. The device of claim 4 , wherein, in the storage region, an overflow region is separated off by way of an overflow wall, into which coolant overflows and from which, when the fill level is reached, coolant runs via the overflow pipe into the evaporator region.
15. The device of claim 6 , wherein the heat source is a resistive heater.
16. The device of claim 7 , wherein the heat source is a floor surface of the evaporator region.
17. The device of claim 1 , wherein the storage region, the evaporator region and the overflow pipe are housed within the storage vessel.