Access devices to correlated electron switch
Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.
1. A method comprising:
forming one or more first layers comprising a metal oxide to provide a correlated electron switch (CES); and
forming one or more second layers between a third layer and the one or more first layers to provide a first access device to the CES, wherein the third layer comprises a metal layer to provide a first terminal of the CES.
2. The method of claim 1 , and further comprising forming one or more fourth layers between a fifth layer and the one or more first layers to provide a second access device to the CES, wherein the fifth layer comprises a metal layer to provide a second terminal of the CES.
3. The method of claim 1 , wherein the one or more second layers are n-type doped or p-type doped.
4. The method of claim 1 , wherein the third layer is formed over the one or more second layers.
5. The method of claim 1 , wherein the one or more second layers comprises a metal oxide.
6. The method of claim 1 , wherein the one or more second layers comprises a polysilicon.
7. A device comprising:
one or more first layers comprising a metallic oxide comprising a correlated electron switch (CES);
one or more terminals;
one or more second layers formed between a first terminal of the one or more terminals and the one or more first layers to form a first access device to the CES; and
one or more third layers formed between a second terminal of the one or more terminals to form a second access device to the CES.
8. The device of claim 7 , wherein the CES is responsive to application of a first voltage across the one or more first metallic layers while maintaining a first current through the one or more first layers to place the CES in a high impedance or insulative state;
wherein the CES is responsive to application of a second voltage across the one or more first layers while maintaining a second current through the one or more first layers to place the memory state of the CES element in a low impedance or conductive state; and
wherein the state of the CES element is detectable based, at least in part, on a measured current through the access device in response to application of a third voltage across the one or more first layers.
9. The device of claim 1 , wherein the one or more first layers are separated from the one or more second layers by a first metallic layer, and wherein the one or more first layers are separated from the one or more third layers by a second metallic layer.
10. The device of claim 1 , wherein the one or more first layers are p-type doped, wherein the one or more second layers are n-type doped, and wherein the one or more third layers comprise a correlated electron material in an intrinsic state.
11. The device of claim 1 , wherein the one or more first layers are p-type doped, and wherein the one or more second layers and the one or more third layers comprise a correlated electron material in an intrinsic state.
12. The device of claim 1 , wherein the one or more first layers comprise a correlated electron material in an intrinsic state, and wherein the one or more second layers and the one or more third layers are n-type doped.
13. The device of claim 1 , wherein the first access device comprises a P/N junction diode, a Schottky barrier diode, a metal-insulator-metal (MIM) diode, a tunnel diode or a varistor, or a combination thereof.
14. The device of claim 7 , wherein the one or more first layers and the one or more second layers are formed from a correlated electron material (CEM), and wherein the one or more first layers are p-type doped.
15. The device of claim 7 , wherein the device comprises a correlated electron random access memory (CeRAM) element in a crosspoint memory array.
16. The device of claim 7 , wherein the first layer is p-type doped, wherein the second and third layers are n-type doped.
17. The device of claim 14 , wherein the one or more second metallic oxide layers comprise the CEM in an intrinsic state.
18. The device of claim 7 , wherein the one or more second layers comprises zinc oxide doped with bismuth.
19. The device of claim 14 , wherein the one or more second layers are n-type doped.