Mold component
There is provided a member of a mold stack ( 100, 800 ), the member comprising: a member body ( 102, 802 ) defining a member molding surface for defining, in use, a portion of a molding cavity for molding a molded article, a member cooling circuit ( 120, 820 ) having a plurality of member cooling channels ( 128, 829 ), the plurality of member cooling channels ( 128, 829 ) being coupled in parallel to a source of cooling fluid, the member cooling circuit ( 120, 820 ) being fully encapsulated within the member body ( 102, 802 ).
1. A member of a mold stack ( 100 , 800 ), the member comprising:
a member body ( 102 , 802 ) defining:
a member molding surface ( 106 , 806 ) for defining, in a use, a portion of a molding cavity for molding a molded article;
a member cooling circuit ( 120 , 820 ) having a plurality of member cooling channels ( 128 , 829 ), the plurality of member cooling channels ( 128 , 829 ) being coupled in parallel to a source of cooling fluid, the member cooling circuit ( 120 , 820 ) being fully encapsulated within the member body ( 102 , 802 ).
2. The member of a mold stack ( 100 , 800 ) of claim 1 , the member being implemented as a core insert ( 100 ).
3. The member of a mold stack ( 100 , 800 ) of claim 1 , the member being implemented as a cavity insert ( 800 ).
4. The member of a mold stack ( 100 , 800 ) of claim 1 , wherein the plurality of member cooling channels ( 128 , 829 ) has been defined by direct metal laser sintering (DMLS).
5. The member of a mold stack ( 100 , 800 ) of claim 1 , wherein the plurality of member cooling channels ( 128 , 829 ) is defined by and intermeshed between a network of member cooling channel supports ( 136 , 836 ).
6. The member of a mold stack ( 100 , 800 ) of claim 1 , wherein the network of member cooling channel supports ( 136 , 836 ) is instrumental in drawing some heat away from the member molding surface ( 106 , 806 ).