Light emitting module
A light emitting module including a plurality of light emitting elements, a plurality of first circuit boards, and a second circuit board is provided. Each of the light emitting elements is disposed on the corresponding first circuit board and is electrically connected to the corresponding first circuit board. The second circuit board is disposed on the first circuit boards, wherein any two adjacent first circuit boards are electrically connected to each other through the second circuit board.
1. A light emitting module, comprising:
a plurality of light emitting elements, wherein each of the light emitting elements has a front surface;
a plurality of first circuit boards, wherein the front surface of each of the light emitting elements is disposed and faced on the corresponding first circuit board and electrically connected to the corresponding first circuit board through two electrodes of each of the light emitting elements, wherein the two electrodes are disposed between the corresponding first circuit board and the front surface of each of the light emitting elements; and
a second circuit board, disposed on a same side of the first circuit boards with the plurality of light emitting elements, wherein any two adjacent first circuit boards are electrically connected to each other through the second circuit board, each of the first circuit boards has a first circuit layer, the light emitting elements and the second circuit board are disposed on a same side of the first circuit layers, and the light emitting elements and the second circuit board respectively cover and contact two opposite end portion of the first circuit layers.
2. The light emitting module as claimed in claim 1 , wherein each of first circuit layers faces the front surface of the corresponding light emitting element, the first circuit layer has a first pad and a second pad that are electrically opposite pads, one of the two electrodes is electrically connected to the first pad, while the other of the two electrodes is electrically connected to the second pad.
3. The light emitting module as claimed in claim 2 , wherein the second circuit board has a first surface, a second surface opposite to the first surface, and a second circuit layer located on the first surface, the second circuit board is disposed on the first circuit boards with the first surface, and any two adjacent first circuit boards are electrically connected to each other through the second circuit layer.
4. The light emitting module as claimed in claim 3 , wherein the first pad of one of the any two adjacent first circuit boards is electrically connected to the second pad of the other of the any two adjacent first circuit boards through the second circuit layer.
5. The light emitting module as claimed in claim 4 , wherein the second circuit layer has two third pads and a plurality of fourth pads between the third pads, the n th fourth pad and the (n+1) th fourth pad are electrically connected to each other, the first pad of one of the any two adjacent first circuit boards is electrically connected to the second pad of the other of the any two adjacent first circuit boards through the n th and the (n+1) th fourth pads of the second circuit layer, and n is an odd number.
6. The light emitting module as claimed in claim 3 , wherein the second circuit board further comprises at least two conductive vias penetrating the first surface and the second surface and a third circuit layer located on the second surface, and the second circuit layer is electrically connected to the third circuit layer through the corresponding conductive via.
7. The light emitting module as claimed in claim 1 , further comprising:
a carrier, wherein the first circuit boards are disposed on the carrier.
8. The light emitting module as claimed in claim 7 , wherein the carrier has a carrying portion at a side away from the first circuit boards, and the second circuit board is disposed on the carrying portion.
9. The light emitting module as claimed in claim 8 , wherein a carrying surface of the caning portion where the second circuit board is disposed and upper surfaces of the first circuit boards where the second circuit board is disposed are coplanar.
10. The light emitting module as claimed in claim 1 , further comprising:
a third circuit board, located at a side away from the first circuit boards, wherein the second circuit board is disposed on the third circuit board and the first circuit boards, and any two adjacent first circuit boards are electrically connected to the third circuit board through the second circuit board.
11. The light emitting module as claimed in claim 10 , further comprising:
a carrier, wherein the first circuit boards and the third circuit board are disposed on the carrier.
12. The light emitting module as claimed in claim 10 , wherein an upper surface of the third circuit board where the second circuit board is disposed and upper surfaces of the first circuit boards where the second circuit board is disposed are coplanar.