Multi-layered electronic system
A multi-layered electronic system has a support substrate including at least a primary conductive track; a security layer including at least a conductive security track; an electrically-conductive engagement element in electrical communication with the primary conductive tack, and to which the security layer is mounted so that the conductive security track is in permanent electrical communication with the primary conductive track; and a flexible cover layer which overlies the security layer and which is directly or indirectly secured to the support substrate. The electrical connection between the security layer, conductive engagement element and primary conductive track is interrupted when the conductive security track is broken.
1. A multi-layered anti-tamper electronic system comprising:
a support substrate including at least a primary conductive track;
a security layer including at least a conductive security track;
an electrically-conductive engagement element in electrical communication with the primary conductive track, and to which the security layer is mounted so that the conductive security track is in permanent electrical communication with the primary conductive track through the electrically-conductive engagement element; and
a flexible cover layer which overlies the security layer and which is directly or indirectly secured to the support substrate;
wherein the electrical connection between the security layer, conductive engagement element and primary conductive track is interrupted when the conductive security track is broken; and
wherein the primary conductive track includes first and second primary terminals, the conductive security track includes first and second security terminals, the conductive engagement element being mounted between the first primary terminal and the first security terminal and a further conductive engagement element being mounted between the second primary terminal and the second security terminal, the primary conductive track and security track forming a complete circuit.
2. The system of claim 1 , wherein the conductive engagement element is formed from a non-deformable material, thereby providing a tension to the flexible cover layer for compressively retaining the security layer against the conductive engagement element.
3. The system of claim 1 , wherein the conductive engagement element is an electrical component secured to the support substrate.
4. The system of claim 3 , wherein the electrical component is a resistor, capacitor or diode.
5. The system of claim 1 , wherein the conductive engagement element is a solder bump.
6. The system of claim 1 , wherein the conductive engagement element is formed from an electrically-conductive foam.
7. The system of claim 1 , wherein the conductive engagement element is an electrically-conductive adhesive.
8. The system of claim 1 , wherein the conductive security track follows a meandering, tortuous, serpentine or zig-zagged path.
9. The system of claim 8 , wherein the conductive security track covers a majority of a lower surface of the flexible cover layer.
10. The system of claim 1 , wherein the security layer is integrally formed with the flexible cover layer.
11. The system of claim 1 , wherein the support substrate is a printed circuit board.
12. The system of claim 1 , wherein the flexible cover layer is directly secured to the support substrate using an adhesive.
13. The system of claim 1 , wherein the primary conductive track is formed from copper.
14. The system of claim 1 , wherein the conductive security track is formed from copper or silver.
15. The system of claim 1 , further comprising a retaining element overlying the flexible cover layer directly above the conductive engagement element, the retaining element applying a retaining force towards the support substrate to reinforce the physical and electrical connection between the security layer, the conductive engagement element and the support substrate.
16. The system of claim 15 , wherein the retaining element is a spigot.
17. An anti-tamper electronic device, wherein the circuitry of the device includes the multi-layered anti-tamper electronic system of claim 1 .
18. The anti-tamper electronic device of claim 17 , wherein at least the flexible cover layer is connected to a case or housing of the electronic device.
19. A method of deactivating the anti-tamper electronic device of claim 17 , comprising the steps of: a] tampering with a case or housing of the device; and b] resultantly damaging the flexible cover layer of the multi-layer electronic system due to the tampering, thereby breaking the conductive security track and therefore electronic circuit, deactivating the device.
20. The anti-tamper electronic device of claim 17 , wherein the electrically-conductive engagement element is disposed between the conductive security track and the primary conductive track.
21. The system of claim 1 , wherein the electrically-conductive engagement element is disposed between the conductive security track and the primary conductive track.