IP Library Granted Patent US 9,778,708
Granted Patent B1
US 9,778,708 · App. 15/212,620 · Granted Oct 3, 2017

Dual sided latching retainer for computer modules

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Quick Facts
Patent No.
US 9,778,708
App. No.
15/212,620
Granted
Oct 3, 2017
Kind
B1
Abstract

Dual sided latching retainers including a latching mechanism fixing the dual sided latching retainer to a computer board assembly; a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly; a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly.

Claims (35)

1. A dual sided latching retainer comprising:

a latching mechanism fixing the dual sided latching retainer to a computer board assembly;

a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly;

a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly;

wherein the first computer module is operatively connected to the first side of the computer board assembly via a first module connector, and wherein the second computer module is operatively connected to the second side of the computer board assembly via a second module connector.

2. The dual sided latching retainer of claim 1 , wherein the latching mechanism enables the dual side latching retainer to be removed from the computer board assembly.

3. The dual sided latching retainer of claim 1 , wherein the latching mechanism comprises:

a retaining pin configured for insertion into a retaining pin cavity on the computer board assembly; and

a latch release tab configured to release the retaining pin from the retaining pin cavity.

4. The dual sided latching retainer of claim 1 , further comprising:

a keyhole setting configured to receive a narrow end of a keyhole cavity of the computer board assembly.

5. The dual sided latching retainer of claim 1 , wherein the computer module is an M.2 module.

6. An injection mold comprising:

a cavity configured to receive liquid, injected material, the cavity having a shape defined by a dual sided latching retainer, the dual sided latching retainer comprising:

a latching mechanism fixing the dual sided latching retainer to a computer board assembly;

a first module retention feature configured to receive a first computer module held between the first module retention feature and a first module support surface, wherein the first module retention feature holds the first computer module against a first side of the computer board assembly;

a second module retention feature configured to receive a second computer module held between the second module retention feature and a second module support surface, wherein the second module retention feature holds the second computer module against a second side of the computer board assembly;

wherein the first computer module is operatively connected to the first side of the computer board assembly via a first module connector, and wherein the second computer module is operatively connected to the second side of the computer board assembly via a second module connector.

7. The injection mold of claim 6 , wherein the latching mechanism enables the dual side latching retainer to be removed from the computer board assembly.

8. The injection mold of claim 6 , wherein the latching mechanism comprises:

a retaining pin configured for insertion into a retaining pin cavity on the computer board assembly; and

a latch release tab configured to release the retaining pin from the retaining pin cavity.

9. The injection mold of claim 6 , wherein the dual sided latching retainer further comprises:

a keyhole setting configured to receive a tapered end of a keyhole cavity of the computer board assembly.

10. The injection mold of claim 6 , wherein the computer module is an M.2 module.

11. A computer board assembly comprising:

a first module connector attached to a first side of the computer board assembly, wherein the first module connector is configured to receive a first computer module;

a second module connector attached to a second side of the computer board assembly, wherein the second module connector is configured to receive a second computer module;

at least two keyhole cavities configured to receive a dual sided latching retainer configured to:

hold the first computer module against the first side of the computer board assembly; and

hold the second computer module against the second side of the computer board assembly.

12. The computer board assembly of claim 11 , further comprising one or more retaining pin cavities configured to receive a retaining pin of the dual sided latching retainer.

13. The computer board assembly of claim 11 , wherein the first module connector and the second module connector are placed in a same location on opposite sides of the computer board assembly and oriented in the same direction.

14. The computer board assembly of claim 11 , further comprising a board connector configured to communicatively couple the computer board assembly to a computer system.

15. The computer board assembly of claim 11 , wherein a first keyhole cavity of the at least two keyhole cavities is configured for a first size of the first computer module and the second computer module, and wherein a second keyhole cavity of the at least two keyhole cavities is configured for a second size of the second computer module and the second computer module.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 050308/0781 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2016
From: MESERTH, TIMOTHY A.; WORMSBECHER, PAUL A.; WU, YI-LUNG
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 039178/0229 →