IP Library Granted Patent US 9,817,448
Granted Patent B2
US 9,817,448 · App. 14/804,839 · Granted Nov 14, 2017

Hot swap system and electronic device utilizing the same

Inventor: Meng-Liang Yang (Shenzhen, CN)
Assignee: MiiCs & Partners (Shenzhen) Co., Ltd.
G06F1/18
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Quick Facts
Patent No.
US 9,817,448
App. No.
14/804,839
Granted
Nov 14, 2017
Kind
B2
Abstract

A hot swap system applied in an electronic device includes a plurality of expansion cards and a plurality of electronic components coupled to the expansion cards. Each of the expansion cards includes an expansion chip, a time delay unit, and a switch unit. The time delay unit is electrically coupled to the expansion chip, and outputs a delay signal to the expansion chip to control the expansion chip not operate within a preset time. The switch unit can operate and transmit signal between the corresponding expansion card and the plurality of electronic components after preset time. Therefore, the hot swap system can operate normally, even when one of the expansion cards is inserted suddenly.

Claims (24)

1. A hot swap system comprising:

a plurality of electronic components; and

a plurality of expansion cards, each one of the expansion cards electrically coupled to one of the electronic components from amongst plurality of electronic components, each one of the expansion cards comprising:

an expansion chip;

a time delay unit electrically coupled to the expansion chip, and configured to output a delay signal to the expansion chip, to control the expansion chip not operate within a preset time, wherein the time delay unit can comprise a delay chip, a first resistor, a second resistor, and a capacitor; a reset pin of the delay chip is electrically coupled to a reset pin of the expansion chip, and is electrically coupled to a power supply through the first resistor; a voltage pin of the delay chip is electrically coupled to the power supply; a ground pin of the delay chip is grounded; a sense pin of the delay chip is electrically coupled to the power supply; a time pin of the delay chip is electrically coupled to ground through the first capacitor; and a manual reset pin of the expansion chip is electrically coupled to the power supply through the second resistor; and

a switch unit electrically coupled to the expansion chip, wherein the switch unit can operate and transmit a signal to the electronic component to which the expansion card is coupled, after preset time.

2. The hot swap system of claim 1 , wherein the switch unit can comprise a switch control chip, voltage pins of the switch control chip are electrically coupled to the power supply; a ground pin of the switch control chip is grounded; an enable pin of the switch control chip is electrically coupled to the reset pin of the expansion chip; a first clear pin of the switch control chip is electrically coupled to a clear pin of the expansion chip; a second clear pin of the switch control chip is electrically coupled to the plurality of electronic components; a second data pin of the switch control chip is electrically coupled to a data pin of the expansion chip; and a second data pin of the switch control chip is electrically coupled to the plurality of electronic components.

3. The hot swap system of claim 2 , wherein when first expansion chip is inserted, the reset pin of the delay chip outputs a digital low level signal to the reset pin of the first expansion chip, to control the first expansion chip is reset within the preset time; after the preset time, the first expansion chip starts to operate, and the switch control chip is turned on, the switch control chip can transmit signal between the first expansion card and the plurality of electronic components.

4. The hot swap system of claim 3 , wherein the second expansion card is inserted, in event that the first expansion card is operating, the second expansion card cannot transmit signal with the plurality of electronic components within the preset time.

5. The hot swap system of claim 4 , wherein the switch control chip transmits signal between the corresponding expansion card and the plurality of electronic components through a corresponding inter integrated circuit cable.

6. The hot swap system of claim 1 , further comprising a motherboard, a device unit, and a backboard, wherein the plurality of expansion cards are set on the motherboard, and the device unit is set on the backboard.

7. The hot swap system of claim 6 , further comprising a plurality of connectors, wherein each of the expansion cards is electrically coupled to the electronic components through a corresponding connector.

8. An electronic device comprising a hot swap system, the hot swap system comprising:

a plurality of electronic components; and

a plurality of expansion cards, each of the expansion cards electrically coupled to the plurality of electronic components, and comprising:

an expansion chip;

a time delay unit electrically coupled to the expansion chip, and configured to output a delay signal to the expansion chip, to control the expansion chip not operate within a preset time, wherein the time delay unit can comprise a delay chip, a first resistor, a second resistor, and a capacitor; a reset pin of the delay chip is electrically coupled to a reset pin of the expansion chip, and is electrically coupled to a power supply through the first resistor; a voltage pin of the delay chip is electrically coupled to the power supply; a ground pin of the delay chip is grounded; a sense pin of the delay chip is electrically coupled to the power supply; a time pin of the delay chip is electrically coupled to ground through the first capacitor; and a manual reset pin of the expansion chip is electrically coupled to the power supply through the second resistor; and

a switch unit electrically coupled to the expansion chip, wherein the switch unit can operate and transmit signal between the corresponding expansion card and the plurality of electronic components after preset time.

9. The electronic device of claim 8 , wherein the switch unit can comprise a switch control chip, voltage pins of the switch control chip are electrically coupled to the power supply; a ground pin of the switch control chip is grounded; an enable pin of the switch control chip is electrically coupled to the reset pin of the expansion chip; a first clear pin of the switch control chip is electrically coupled to a clear pin of the expansion chip; a second clear pin of the switch control chip is electrically coupled to the plurality of electronic components; a second data pin of the switch control chip is electrically coupled to a data pin of the expansion chip; and a second data pin of the switch control chip is electrically coupled to the plurality of electronic components.

10. The electronic device of claim 9 , wherein when first expansion chip is inserted, the reset pin of the delay chip outputs a digital low level signal to the reset pin of the first expansion chip, to control the first expansion chip is reset within the preset time; after the preset time, the first expansion chip starts to operate, and the switch control chip is turned on, the switch control chip can transmit signal between the first expansion card and the plurality of electronic components.

11. The electronic device of claim 10 , wherein the second expansion card is inserted, in event that the first expansion card is operating, the second expansion card cannot transmit signal with the plurality of electronic components within the preset time.

12. The electronic device of claim 11 , wherein the switch control chip transmits signal between the corresponding expansion card and the plurality of electronic components through a corresponding inter integrated circuit cable.

13. The electronic device of claim 8 , further comprising a motherboard, a device unit, and a backboard, wherein the plurality of expansion cards are set on the motherboard, and the device unit is set on the backboard.

14. The electronic device of claim 13 , further comprising a plurality of connectors, wherein each of the expansion cards is electrically coupled to the electronic components through a corresponding connector.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2017
From: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
To: MIICS & PARTNERS (SHENZHEN) CO., LTD.
Reel/Frame 043551/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2017
From: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 042957/0102 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2015
From: YANG, MENG-LIANG
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 036144/0119 →
Continuity (1)
Related Publication 20170027078A1 · Jan 26, 2017