Opto-electronic apparatus and manufacturing method thereof
An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.
1. A manufacturing method of an opto-electronic apparatus, comprising steps of:
disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between a highest point of the matrix circuit and a surface of the substrate;
disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between a highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and
performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material,
wherein each of the plurality of first protrusion has a top surface area, which is neater than 50% of a bottom surface area of each of the plurality of first opto-electronic unit.
2. The manufacturing method of claim 1 , wherein the transfer step further comprises:
reversing the first carrier so that the first opto-electronic units are placed facing the matrix circuit; and
aligning the first protrusions and the first opto-electronic units, which are located on the first carrier and are not disposed adjacent to one another.
3. The manufacturing method of claim 2 , wherein a pitch between two of the first opto-electronic units, which are located on the first carrier and are not disposed adjacent to one another, is equal to a pitch between two of the first protrusions, which are located on the substrate and are disposed adjacent to one another.
4. The manufacturing method of claim 1 , wherein the transfer step further comprises:
selecting a plurality of the first opto-electronic units, which are located on the first carrier and are not disposed adjacent to each other, by a polycrystalline selecting device; and
placing the selected first opto-electronic units on the corresponding first protrusions by the polycrystalline selecting device.
5. The manufacturing method of claim 1 , further comprising steps of:
disposing a planarization layer to cover the first protrusions and at least a part of the first opto-electronic units;
etching the planarization layer to form at least one opening for exposing a driving electrode disposed in the matrix circuit; and
electrically connecting the driving electrode to a conductive portion of each of the first opto-electronic units.
6. The manufacturing method of claim 1 , further comprising a step of:
disposing a plurality of second protrusions above the substrate, wherein at least one of the second protrusions has a second protrusion thickness between a highest point of the second protrusion and the surface of the substrate.
7. A manufacturing method of claim 6 , wherein the second protrusion thickness is greater than the first protrusion thickness.
8. The manufacturing method of claim 7 , further comprising a step of:
performing a second transfer step for transferring a plurality of second opto-electronic units from a second carrier to the second protrusions and bonding the second protrusions to at least two of the second opto-electronic units with another adhesive material.
9. The manufacturing method of claim 8 , wherein a sum of the second protrusion thickness and a thickness of the second opto-electronic unit is greater than a sum of the first protrusion thickness and a thickness of the first opto-electronic unit.
10. The opto-electronic apparatus, comprising:
a substrate;
a matrix circuit disposed on the substrate, wherein the matrix circuit has a matrix circuit thickness between a highest point of the matrix circuit and a surface of the substrate;
a plurality of first protrusions disposed above the substrate; and
a plurality of first opto-electronic units bonded to the first protrusions by an adhesive material;
wherein at least one of the first protrusions has a first protrusion thickness between a highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness,
wherein each of the plurality of first protrusion has a top surface area, which is greater than 50% of a bottom surface area of each of the plurality of first opto-electronic unit.
11. The opto-electronic apparatus of claim 10 , wherein the adhesive material is electrical conductive, and the first opto-electronic units are electrically connected to the matrix circuit by the adhesive material.
12. The opto-electronic apparatus of claim 10 , further comprising:
a planarization layer covering the first protrusions and at least a part of the first opto-electronic units, wherein the planarization layer has at least one opening for exposing a driving electrode disposed in the matrix circuit, and a conductive portion of each of the first opto-electronic units is electrically connected to the driving electrode.
13. The opto-electronic apparatus of claim 12 , further comprising:
at least a black frame layer disposed on the planarization layer and surrounding at least one of the first opto-electronic units.
14. The opto-electronic apparatus of claim 10 , further comprising:
at least a fluorescent layer disposed on at least a part of the first opto-electronic units.
15. The opto-electronic apparatus of claim 10 , further comprising:
a cover disposed corresponding to the substrate.
16. The opto-electronic apparatus of claim 15 , wherein the cover further has a
plurality of filter layers disposed corresponding to the first opto-electronic units.
17. The opto-electronic apparatus of claim 10 , further comprising:
a plurality of second protrusions disposed above the substrate, wherein at least one of the second protrusions has a second protrusion thickness between a highest point of the second protrusion and the surface of the substrate; and
a plurality of second opto-electronic units bonded to the second protrusions by another adhesive material.
18. The opto-electronic apparatus of claim 17 , wherein a sum of the second protrusion thickness and a thickness of the second opto-electronic unit is greater than a sum of the first protrusion thickness and a thickness of the first opto-electronic unit.
19. The opto-electronic apparatus of claim 17 , wherein the second protrusion thickness is greater than the first protrusion thickness.