Semiconductor structure with two optically coupled optical resonant cavities and method of manufacturing such a structure

1. A semiconductor structure capable of absorbing an electromagnetic wave in a predetermined range of wavelengths which is centered around a wavelength λ 0 , the semiconductor structure comprising:

at least one first semiconductor resonant optical cavity comprising a first resonance wavelength, the first resonance wavelength being comprised in the predetermined range of wavelengths, the first resonant optical cavity being configured to absorb at least partially the electromagnetic wave and to provide an electrical signal proportional to the absorbed part of the electromagnetic wave,

wherein the semiconductor structure further comprises:

a second dielectric resonant optical cavity comprising a second resonance wavelength, the second resonance wavelength being comprised in the predetermined range of wavelengths, the second resonant optical cavity being configured to intercept at least part of the electromagnetic wave and being optically coupled to the first resonant optical cavity,

the second resonant optical cavity being transparent to the predetermined range of wavelengths, wherein the second resonant optical cavity comprises an optical index N 2 less than 2.

2. The semiconductor structure according to claim 1 , wherein the second resonant optical cavity is made of a material selected from the group comprising glasses, thermoplastic polymers, elastomers, thermosetting polymers, photosensitive resins and mixtures of two or more of said materials.

3. The semiconductor structure according to claim 1 , wherein the semiconductor structure is configured to receive the electromagnetic wave along a mean emission direction z,

the first resonant optical cavity being dimensioned to have at least one first resonance direction, corresponding to the first resonance wavelength, the first resonance direction being transversal to the emission direction z.

4. The semiconductor structure according to claim 3 , wherein the first resonant optical cavity has a first width L 1 along the first resonance direction,

and wherein the second resonant optical cavity has along at least the first resonance direction a second width L 2 respecting the following equation:

L

2

=

L

1

×

M

×

N

2

N

1

,

 with L 2 the second width, L 1 the first width, M an odd integer greater than or equal to 1, N 1 and N 2 the respective optical indices of the first and the second resonant optical cavities.

5. The semiconductor structure according to claim 1 , including a support having a first and a second face opposite to each other, the first resonant optical cavity being arranged in contact on the first face and the second resonant optical cavity being arranged in contact on the second face, the support being dimensioned in order to assure optical coupling between the first and the second resonant optical cavities.

6. The semiconductor structure according to claim 1 , wherein the semiconductor structure is a structure of the type selected from the group comprising PIN type photodiodes, quantum well photodiodes, barrier type photodetectors,

and wherein an active zone of the semiconductor structure is furnished in the first resonant optical cavity.

7. The semiconductor structure according to claim 1 , including at least two first resonant optical cavities, the first resonant optical cavities each being optically coupled to the second resonant optical cavity.

8. A semiconductor component comprising a plurality of semiconductor structures each to receive an electromagnetic wave, wherein at least one, of the semiconductor structures is a semiconductor structure according to claim 1 .

9. A method of manufacturing a semiconductor structure capable of absorbing an electromagnetic wave in a predetermined range of wavelengths which is centered around a wavelength λ 0 ,

the method comprising the following steps:

supplying at least one first semiconductor resonant optical cavity comprising a first resonance wavelength, the first resonance wavelength being comprised in the predetermined range of wavelengths, the first resonant optical cavity being configured to absorb at least partially the electromagnetic wave and to provide an electrical signal proportional to the absorbed part of the electromagnetic wave,

supplying a second dielectric resonant optical cavity comprising a second resonance wavelength, the second resonant wavelength being comprised in the range of wavelengths, the second resonant optical cavity being configured to intercept part of the electromagnetic wave and being optically coupled to the first resonant optical cavity,

wherein the second resonant optical cavity is transparent to the predetermined range of wavelengths and wherein the second resonant optical cavity comprises an optical index N 2 less than 2.

10. The method of manufacture according to claim 9 wherein the step of supplying the first resonant optical cavity comprises the following sub-steps:

supplying a semiconductor support comprising a first and a second face,

formation of the first resonant optical cavity in contact with the first face of the support,

and wherein the step of supplying a second resonant optical cavity consists in forming said second resonant optical cavity in contact with the second face of the support.

11. The method of manufacture according to claim 10 , wherein the step of supplying the second resonant optical cavity comprises the following sub-steps:

deposition of a photosensitive resin layer on the surface of the support,

exposing a part of the photosensitive resin layer, the part of the photosensitive resin layer corresponding to:

the second resonant optical cavity, if the photosensitive resin layer is made of a positive photosensitive resin type,

the photosensitive resin layer excluding the part corresponding to second resonant optical cavity, if said photosensitive resin layer is made of a negative photosensitive resin type, and

developing the layer of photosensitive resin using a solvent to form the second optical cavity into the layer of photosensitive resin.