Functionalization of a substrate
A method of increasing a work function of an electrode is provided. The method comprises obtaining an electronegative species from a precursor using electromagnetic radiation and reacting a surface of the electrode with the electronegative species. An electrode comprising a functionalized substrate is also provided.
1. An apparatus for functionalizing a substrate with an electronegative species, the apparatus comprising:
a reaction chamber for receiving a precursor and the substrate, the precursor containing the electronegative species;
a first electrode and a second electrode disposed within the reaction chamber, at least one of the first electrode and the second electrode being adapted to be connected to a power source to generate a plasma for obtaining the electronegative species from the precursor for bonding with the substrate to increase the work function of the substrate; and
a plasma shield configured to prevent at least a portion of the plasma generated in the region between the second electrode and the plasma shield from directly impinging on the substrate; and one or more members electrically connecting the first electrode and the plasma shield.
2. The apparatus of claim 1 , wherein the plasma shield is positioned between the first electrode and the second electrode.
3. The apparatus of claim 1 , further comprising a substrate support for supporting the substrate.
4. The apparatus of claim 1 , wherein at least one of the first and the second electrode is adapted to support the substrate.
5. The apparatus of claim 1 , wherein the reaction chamber is grounded.
6. The apparatus of claim 1 , wherein the at least a portion of the plasma prevented from directly impinging on the substrate includes the portion of the plasma having the highest energy.
7. The apparatus of claim 1 , wherein the plasma shield is grounded.
8. The apparatus of claim 1 , wherein the substrate is received between the first electrode and the plasma shield.