Induction-based heat retentive server
A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
1. A method of induction heating food on an unheated dish via a heat retentive server, the heat retentive server having an induction-heatable member enclosed within a body, the body having a heat deflection temperature, wherein the method does not require preheating the dish in a dish heater prior to placing the dish on the server in order to maintain the food at a desired temperature for a desired period of time, the method comprising the following steps, which may be performed in any order except as indicated:
induction heating the induction-heatable member to a temperature greater than the heat deflection temperature of the body;
buffering the heat transfer from the induction-heatable member to the body via an inhibitively conductive hydrophobic material, wherein the buffering prevents deformation of the body;
heating food to a temperature of about 165° F.;
after the food is heated, placing the food on an unheated dish, the unheated dish being a dish that has not been heated in a dish heater;
placing the unheated dish on the heat retentive server;
heating the unheated dish by allowing heat transfer from the heat retentive server to the unheated dish to increase the temperature of the unheated dish;
covering the food and the unheated dish with an insulated cover after the food and unheated dish are placed on the heat retentive server; and
maintaining the food at a temperature above 140° F. for one hour after covering the food and the unheated dish with the insulated cover.
2. The method according to claim 1 , further comprising washing the unheated dish prior to the placing of the food on the unheated dish.
3. The method according to claim 2 , wherein the step of induction heating of the induction-heatable member comprises induction heating the induction-heatable member to greater than a temperature in the range from about 417° F. to about 511° F.
4. The method according to claim 2 , wherein the step of induction heating of the induction-heatable member comprises induction heating the induction-heatable member to greater than about 464° F. when tested with a load of 264 psi.
5. The method according to claim 2 , wherein the placing of the unheated dish on the body is further comprised of placing the unheated dish on the body while the induction-heatable member is at a temperature greater than the heat deflection temperature of the body.
6. The method according to claim 1 , wherein the inhibitively conductive hydrophobic material is a silica aerogel material.
7. The method according to claim 6 , wherein the inhibitively conductive hydrophobic material is about 2 mm thick.
8. The method according to claim 6 , wherein the first layer of inhibitively conductive hydrophobic material is nanoporous insulation.
9. The method according to claim 1 , wherein the step of buffering the heat transfer from the induction-heatable member to the body is further comprised of: buffering the heat transfer from the induction-heatable member to the body by buffering the heat transfer via a second layer of inhibitively conductive hydrophobic material.
10. The method according to claim 9 , wherein the second layer of inhibitively conductive hydrophobic material is about 5 mm thick.
11. The method according to claim 9 , wherein the second layer of inhibitively conductive hydrophobic material is nanoporous insulation.
12. The method according to claim 9 , wherein the second layer of inhibitively conductive hydrophobic material is reinforced with non-woven, glass-fiber batting.
13. The method according to claim 9 , wherein the second layer of inhibitively conductive hydrophobic is comprised of silica aerogel material.