IP Library Granted Patent US 9,859,489
Granted Patent B2
US 9,859,489 · App. 14/707,319 · Granted Jan 2, 2018

Integrated circuit having first and second magnetic field sensing elements

Inventors: Michael C. Doogue (Bedford, NH); William P. Taylor (Amherst, NH); Vijay Mangtani (Nashua, NH)
Assignee: Allegro MicroSystems, LLC
H01L43/04B82Y25/00G01R15/207G01R33/02G01R33/06G01R33/07G01R33/09G01R33/093H01L25/162H01L43/065H01L43/08G01R15/08H01L2224/48091H01L2224/48137H01L2224/48247H01L2924/3025
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Quick Facts
Patent No.
US 9,859,489
App. No.
14/707,319
Granted
Jan 2, 2018
Kind
B2
Abstract

An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Claims (41)

1. An integrated circuit, comprising:

a first magnetic field sensing element for providing a first sensitivity to a magnetic field;

a second magnetic field sensing element for providing a selected second different sensitivity to the magnetic field; and

a circuit coupled to the first and second magnetic field sensing elements, operable to provide the integrated circuit with a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, and a tunneling magnetoresistance (TMR) element.

2. The integrated circuit of claim 1 , wherein the first magnetic field sensing element comprises the planar Hall effect element and the second magnetic field sensing element comprises the vertical Hall effect element.

3. The integrated circuit of claim 1 , further comprising a lead frame having a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the first and second magnetic field sensing elements, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

4. The integrated circuit of claim 1 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

5. The integrated circuit of claim 1 , further comprising a substrate, wherein the first and second magnetic field sensing elements are supported by the substrate, wherein the substrate comprised of a selected one of Si, GaAs, InP, InSb, InGaAs, InGaAsP, SiGe, ceramic, or glass.

6. The integrated circuit of claim 1 , further including at least one flux concentrator disposed proximate to at least one of the first magnetic field sensing element or the second magnetic field sensing element.

7. The integrated circuit of claim 1 , wherein the integrated circuit is adapted to be responsive to a current passing through a wire.

8. The integrated circuit of claim 1 , further comprising:

a current conductor disposed proximate to the first or second magnetic field sensing elements; and

a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the first and second magnetic field sensing elements and a second portion of the flux concentrator is disposed above the first and second magnetic field sensing elements.

9. The integrated circuit of claim 1 , wherein the first magnetic field sensing element comprises the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

10. An integrated circuit, comprising:

a substrate;

a first magnetic field sensing element disposed on a surface of the substrate;

a second magnetic field sensing element disposed on the surface of the substrate; and

a circuit coupled to the first and second magnetic field sensing elements, the circuit operable to provide the integrated circuit with a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element, wherein the second magnetic field sensing element has a different structure than the first magnetic field sensing element, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, and a tunneling magnetoresistance (TMR) element.

11. The integrated circuit of claim 10 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

12. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the planar Hall effect element or the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

13. The integrated circuit of claim 10 , further comprising a circuit element disposed on the surface of the substrate.

14. The integrated circuit of claim 10 , further comprising a lead frame having a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the first and second magnetic field sensing elements, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion.

15. The integrated circuit of claim 14 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

16. The integrated circuit of claim 10 , further including at least one flux concentrator disposed proximate to at least one of the first magnetic field sensing element or the second magnetic field sensing element.

17. The integrated circuit of claim 10 , wherein the integrated circuit is adapted to be responsive to a current passing through a wire.

18. The integrated circuit of claim 10 , further comprising:

a current conductor disposed proximate to the first or second magnetic field sensing elements; and

a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the first and second magnetic field sensing elements and a second portion of the flux concentrator is disposed above the first and second magnetic field sensing elements.

19. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the planar Hall effect element and the second magnetic field sensing element comprises the vertical Hall effect element.

20. The integrated circuit of claim 10 , wherein the first magnetic field sensing element comprises the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

21. An integrated circuit, comprising:

a first magnetic field sensing element;

a second magnetic field sensing element;

a circuit coupled to the first and second magnetic field sensing elements, wherein the first and second magnetic field sensing elements are different types of magnetic field sensing elements, wherein the different types of magnetic field sensing elements are two different types in a group of types of magnetic field sensing elements comprising a planar Hall effect element, a vertical Hall effect element, a giant magnetoresistance (GMR) element, an anisotropic magnetoresistance (AMR) element, and a tunneling magnetoresistance (TMR) element; and

a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

22. The integrated circuit of claim 21 , wherein the first magnetic field sensing element comprises the planar Hall effect element and the second magnetic field sensing element comprises the vertical Hall effect element.

23. The integrated circuit of claim 21 , further comprising a conductor, wherein the integrated circuit is adapted to be responsive to magnetic field generated by a current passing through the conductor.

24. The integrated circuit of claim 21 , further comprising:

a substrate, wherein the first magnetic field sensing element, the second magnetic field sensing element, and the circuit are disposed upon the substrate.

25. The integrated circuit of claim 21 , wherein the first magnetic field sensing element comprises the vertical Hall effect element and the second magnetic field sensing element comprises the giant magnetoresistance element, the anisotropic magnetoresistance element, or the tunneling magnetoresistance element.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS AT REEL 053957/FRAME 0874 Recorded Nov 1, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 065420/0572 →
RELEASE OF SECURITY INTEREST IN PATENTS (R/F 053957/0620) Recorded Jun 22, 2023
From: MIZUHO BANK, LTD., AS COLLATERAL AGENT
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 064068/0360 →
PATENT SECURITY AGREEMENT Recorded Jun 22, 2023
From: ALLEGRO MICROSYSTEMS, LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS THE COLLATERAL AGENT
Reel/Frame 064068/0459 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 053957/0874 →
PATENT SECURITY AGREEMENT Recorded Oct 1, 2020
From: ALLEGRO MICROSYSTEMS, LLC
To: MIZUHO BANK LTD., AS COLLATERAL AGENT
Reel/Frame 053957/0620 →
CHANGE OF NAME Recorded May 18, 2015
From: ALLEGRO MICROSYSTEMS, INC.
To: ALLEGRO MICROSYSTEMS, LLC
Reel/Frame 035759/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2015
From: DOOGUE, MICHAEL C.; TAYLOR, WILLIAM P.; MANGTANI, VIJAY
To: ALLEGRO MICROSYSTEMS, INC
Reel/Frame 035635/0839 →
Continuity (4)
Continuation 13918075 · Jun 14, 2013
Division 12792245 · Jun 2, 2010
Division 11335944 · Jan 20, 2006
Related Publication 20150243882A1 · Aug 27, 2015