Flexible circuit electrode array with wire or film support
The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
1. A flexible circuit electrode array, having a flexible circuit cable portion with a length, comprising:
a polymer base layer;
a metal trace layer deposited on said polymer base layer, the metal trace layer including a two dimensional array of electrodes configured to stimulate neural tissue defining an electrode array portion, a two dimensional array of bond pads configured to attach to an electronic circuit package defining a bond pad portion and traces defining a cable portion, the cable portion containing no electrodes, between the electrode array portion and the bond pad portion connecting the electrodes to the bond pads;
a polymer top layer deposited on said polymer base layer and deposited on said metal trace layer;
at least one support embedded lengthwise through the cable portion and the array portion, forming a fold between the cable portion and array portion, not electrically connected to said electrodes or said bond pads, in addition to said metal trace layer, embedded in said flexible circuit electrode array wherein said at least one embedded support is of a material suitable to be manually bent when implanted ensuring better shape control and pressure uniformity, and that a fold or twist once manually made upon implantation holds its shape better than without said at least one embedded support; and
wherein said embedded support comprises at least one wire, film, foil, rod, tube, or strip embedded in said array.
2. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support is comprised of two or more thin rods, wires, tubes or strips.
3. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support is comprised of film or foil.
4. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support comprises at least one metal, metal alloy, metal layer structure, or mixtures thereof.
5. The flexible circuit electrode array according to claim 1 , wherein said embedded support is comprised of titanium, platinum, palladium, iridium, gold, silver, niobium, titanium nitride, iridium oxide, other biocompatible metal, metal alloys, or metal layers.
6. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support comprises at least one polymer, copolymer, block copolymer or mixtures thereof.
7. The flexible circuit electrode array according to claim 6 , wherein said polymer base layer comprises polyimide, thermoplastic polyimide, parylene, liquid crystal polymers (LCP), epoxy resin, polyaryletherketones (PEEK), or a fluoropolymer.
8. The flexible circuit electrode array according to claim 1 , wherein said at least one support embedded in said flexible circuit electrode array is embedded at least in said polymer base layer.
9. The flexible circuit electrode array according to claim 1 , wherein said at least one support embedded in said flexible circuit electrode array is embedded at least in said polymer top layer.
10. The flexible circuit electrode array according to claim 1 , wherein said at least one support embedded in said flexible circuit electrode array is embedded at least between said polymer base layer and said polymer top layer.
11. The flexible circuit electrode array according to claim 1 , wherein said at least one support embedded in said flexible circuit electrode array is only embedded through said length of said flexible circuit cable portion of said flexible circuit electrode array.
12. The flexible circuit electrode array according to claim 1 , wherein said at least one support embedded in said flexible circuit electrode array is embedded only through said length of a flexible circuit electrode region containing said electrodes.
13. The flexible circuit electrode array according to claim 12 , wherein said at least one embedded support has a thickness of 1 micrometer to 5 micrometers.
14. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support has a thickness of 0.1 micrometer to 2 mm.
15. The flexible circuit electrode array according to claim 1 , wherein said at least one embedded support comprises notches, spikes, or a coil to improve adhesion between said wire and said polymer base layer or said polymer top layer.
16. A flexible circuit electrode array comprising:
a polymer base layer;
metal traces deposited on said polymer base layer, said metal traces comprising a two dimension array of electrodes configured to stimulate neural tissue defining an electrode array portion, a two dimensional array of bond pads configured to connect to an electronic circuit package defining a bond pad portion, and traces defining a cable portion between said electrode array portion and said bond pad portion connecting the electrodes to the bond pads, the cable portion containing no electrodes;
a polymer top layer deposited on said polymer base layer and deposited on said metal traces;
a bonded or overmolded polymer layer, softer than said polymer base layer over said polymer top layer and said polymer base layer;
at least one support embedded lengthwise through the cable portion and the array portion, forming a fold between the cable portion and array portion, which is not said metal traces and not including said electrodes or said bond pads, embedded in said bonded or overmolded polymer layer over said flexible circuit electrode array, said at least one support is of a material suitable to be bent when implanted ensuring better shape control and pressure uniformity, and that a fold or twist once manually made upon implantation holds its shape better than without said at least one support; and
wherein said at least one support comprises at least one wire, film, foil, rod, tube, or strip embedded in said array.
17. The flexible circuit electrode array according to claim 16 , wherein said bonded or overmolded polymer layer is comprised of silicone, urethane, or silicone-urethane co-polymer.
18. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support is comprised of one thin rod, wire, tube, or strip.
19. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support is comprised of two or more thin rods, wires, tubes or strips.
20. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support is comprised of film or foil.
21. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support comprises at least one metal, metal alloy, metal layer structure, or mixtures thereof.
22. The flexible circuit electrode array according to claim 21 , wherein said at least one embedded support is comprised of titanium, platinum, palladium, iridium, gold, silver, niobium, titanium nitride, iridium oxide, other biocompatible metal, metal alloys, or metal layers.
23. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support comprises at least one polymer, copolymer, block copolymer, or mixtures thereof.
24. The flexible circuit electrode array according to claim 23 , wherein said polymer base layer is comprised of polyimide, thermoplastic polyimide, parylene, liquid crystal polymers (LCP), epoxy resin, polyaryletherketones (PEEK), or fluoropolymer.
25. The flexible circuit electrode array according to claim 16 , wherein said at least one support embedded in said bonded or overmolded polymer layer is embedded approximately through a length of a flexible circuit electrode region containing said electrodes.
26. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support has a thickness of 0.1 micrometer to 2 mm.
27. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support has a thickness of 1 micrometer to 5 micrometers.
28. The flexible circuit electrode array according to claim 16 , wherein said at least one embedded support comprises notches, spikes, or a coil to improve adhesion between a wire and said overmolded polymer.