Process for producing a layer system
A process for producing a layer system is provided wherein the layer system has at least a substrate, a ceramic layer, which is applied to a surface structured in a targeted manner, in which process the intermediate layer, in particular the metallic layer, is applied in such a way that the recesses form during the coating. By introducing recesses into a surface, the stresses in the ceramic layer on the metallic substrate are reduced in such a manner that a longer lifespan for the ceramic layer is achieved.
1. A process for producing a layer system, comprising:
applying a layer of metallic bonding material to cover a region of a substrate, and then applying additional metallic bonding material over less than all of the layer of metallic bonding material to form a surface comprising recesses, the recesses resulting from a depth of the additional metallic bonding material applied during the step of applying additional metallic bonding material; and
applying a layer of a ceramic material over the surface, wherein ceramic material fills the recesses and mechanically braces the layer of ceramic material with the layer of metallic bonding material.
2. The process as claimed in claim 1 ,
wherein the additional metallic bonding material is applied to form elongate recesses in the surface.
3. The process as claimed in claim 1 ,
in which the recesses form a honeycomb structure.
4. The process as claimed in claim 1 ,
in which the recesses form a mesh structure.
5. The process as claimed in claim 4 , wherein the mesh structure comprises a square or rectangular mesh.
6. The process as claimed in claim 1 ,
in which the recesses have a width of at least 10 μm.
7. The process as claimed in claim 6 , wherein the recesses have a width of 10 μm to 30 μm.
8. The process as claimed in claim 1 ,
in which the additional metallic bonding material is applied such that the recesses have a depth of at least 10% of a thickness of the underlying layer of metallic bonding material.
9. The process as claimed in claim 8 , wherein the recesses have a depth of 10% to 30% of the layer thickness of the layer.
10. The process as claimed in claim 8 , wherein the recesses have a depth of 10 μm to 30 μm.
11. The process as claimed in claim 1 ,
in which the distance between recesses lying opposite one another is at least 100 μm.
12. The process as claimed in claim 11 , wherein the distance between recesses lying opposite one another is between 100 μm and 300 μm.
13. The process as claimed in claim 1 wherein the layer of metallic bonding material comprises an MCrAlX alloy.
14. The process as claimed in claim 1 , wherein a size of the recesses is controlled such that a surface of the layer of ceramic material comprises recesses corresponding to the recesses in the metallic bonding material.
15. The process as claimed in claim 1 , wherein the step of applying additional metallic bonding material is accomplished by targeting spray of a powder from a nozzle onto the selected portions of the layer of metallic bonding material and not onto regions of the recesses.