Apparatus for mounting electronic component
Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.
1. An apparatus for mounting an electronic component having a plurality of board insert type leads on a board, the apparatus comprising:
a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads;
a base body having a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to change relative positions of chucking respective leads by the first chuck unit and the second chuck unit; and
a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board,
wherein the first chuck unit and the second chuck unit extend separately from the base body with no portion of the first chuck unit being attached to the second chuck unit.
2. The apparatus according to claim 1 , further comprising:
a data storing unit in which data that determines a relative positional relation of the first chuck unit and the second chuck unit for each electronic component is stored; and
a position adjusting control unit which operates the position adjusting unit in accordance with the data stored in the data storing unit to adjust the relative positions of the first chuck unit and the second chuck unit.
3. The apparatus according to claim 1 , wherein
the mounting head includes a pressing unit which presses the electronic component, whose leads are inserted into the lead insert holes, toward a side the board.
4. The apparatus according to claim 1 , wherein
the position adjusting unit of the mounting head includes a driving shaft to be rotated and driven, wherein the first chuck unit and the second chuck unit are moved through the driving shaft so as to be separated from or come close to each other.
5. The apparatus according to claim 4 , wherein
the position adjusting unit of the mounting head includes a guide shaft provided in parallel to the driving shaft, wherein the guide shaft passes through the first chuck unit and the second chuck unit.
6. The apparatus according to claim 1 , wherein the first chuck unit includes a pair of grip parts which grip the one of the plurality of leads of the electronic component in between.
7. The apparatus according to claim 1 , wherein the second chuck unit includes a pair of grip parts which grip the another one of the plurality of leads of the electronic component in between.