IP Library Granted Patent US 9,877,417
Granted Patent B2
US 9,877,417 · App. 15/104,007 · Granted Jan 23, 2018

Electronic device with cooling function

Inventors: Yuki Higashi (Toyota, JP); Yuji Omiya (Nagakute, JP)
Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
H05K7/2089H05K5/0008H05K5/061H05K7/1432H05K7/20927
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Quick Facts
Patent No.
US 9,877,417
App. No.
15/104,007
Granted
Jan 23, 2018
Kind
B2
Abstract

An electronic device with a cooling function includes a cap nut, a case, a semiconductor unit, a second bus bar for external output, and a connecting bolt. The case includes a side wall and a bottom surface. The bottom surface of the case has a coolant passage and a recessed portion to receive the cap nut. The coolant passage is open to above and is generally U-shaped. The recessed portion is positioned in a position surrounded by the coolant passage and the side wall of the case, and the cap nut is received in the recessed portion. The semiconductor unit includes a first bus bar that extends from the semiconductor unit. The semiconductor unit is fixed to the case in a posture and position that closes off the coolant passage from above. The second bus bar passes through the side wall of the case. Inside the case, the connecting bolt passes through the first bus bar and the second bus bar and screws into the cap nut, and the cap nut and a head portion of the connecting bolt bring the first bus bar and the second bus bar into close contact.

Claims (12)

1. An electronic device with a cooling function, the electronic device comprising:

a cap nut;

a case that includes a side wall and a bottom surface, the bottom surface of the case having a coolant passage and a recessed portion to receive the cap nut, the coolant passage being open to above, the coolant passage being generally U-shaped, the recessed portion being positioned in a position surrounded by the coolant passage and the side wall of the case, and the cap nut being received in the recessed portion;

a semiconductor unit that includes a first bus bar that extends from the semiconductor unit, the semiconductor unit being fixed to the case in a posture and position that closes off the coolant passage from above;

an second bus bar for external output, the second bus bar passing through the side wall of the case; and

a connecting bolt that passes through the first bus bar and the second bus bar and screws into the cap nut inside of the case, and the cap nut and a head portion of the connecting bolt bringing the first bus bar and the second bus bar into close contact.

2. The electronic device according to claim 1 , further comprising:

an O-ring interposed between the bottom surface of the case and the semiconductor unit; and

a fixing bolt that passes through the semiconductor unit, the fixing bolt screwing into a threaded hole provided in the bottom surface of the case, the semiconductor unit being fixed to the case by the fixing bolt,

wherein the O-ring is compressed between the case and the semiconductor unit, and the cap nut is pulled toward the head portion of the connecting bolt from the recessed portion.

3. The electronic device according to claim 1 , wherein

the semiconductor unit includes a semiconductor module, and a plate that is fixed to the semiconductor module.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: TOYOTA JIDOSHA KABUSHIKI KAISHA
To: DENSO CORPORATION
Reel/Frame 052279/0854 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2016
From: HIGASHI, YUKI; OMIYA, YUJI
To: TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 038971/0775 →
Priority Claims (1)
JP 2013-261403 · Dec 18, 2013 · national
Continuity (1)
Related Publication 20170006731A1 · Jan 5, 2017