Semiconductor device comprising a conductive layer having an air gap
A semiconductor device includes a substrate, gate electrodes and interlayer insulating layers alternately stacked on the substrate, channel regions penetrating through the gate electrodes and the interlayer insulating layers, a conductive layer penetrating through the gate electrodes and the interlayer insulating layers, an insulating layer covering an upper surface of the conductive layer, a contact plug penetrating through the insulating layer and connected to the conductive layer, and an air gap formed in the conductive layer. The conductive layer is connected to the substrate and extends between two groups of the channel regions. The air gap is defined by the contact plug, insulating layer and an inner sidewall of the conductive layer.
1. A semiconductor device, comprising:
a substrate;
gate electrodes and interlayer insulating layers alternately stacked on the substrate;
channel regions penetrating through the gate electrodes and the interlayer insulating layers;
a conductive layer penetrating through the gate electrodes and the interlayer insulating layers,
the conductive layer being connected to the substrate and extending between two groups of the channel regions;
an insulating layer covering an upper surface of the conductive layer; and
a contact plug penetrating through the insulating layer and connected to the conductive layer, the contact plug, the insulating layer and an inner sidewall of the conductive layer defining an air gap in the conductive layer.
2. The semiconductor device of claim 1 , wherein the air gap is open to the upper surface of the conductive layer.
3. The semiconductor device of claim 1 , wherein the air gap extends toward the substrate along the conductive layer from an upper portion of the conductive layer.
4. The semiconductor device of claim 1 , wherein the contact plug contacts the conductive layer on both sides of the air gap.
5. The semiconductor device of claim 1 , wherein
the gate electrodes and the interlayer insulating layers define an open portion that exposes the substrate,
the conductive layer extends into the open portion, and
the air gap is formed in the conductive layer in the open portion.
6. The semiconductor device of claim 1 , further comprising:
a plurality of contact plugs, wherein
the conductive layer extends linearly in one direction,
the plurality of contact plugs include the contact plug, and
the plurality of the contact plugs are spaced apart from each other on the conductive layer.
7. The semiconductor device of claim 1 , wherein a width of the contact plug is narrower than an overall width of the conductive layer on the upper surface of the conductive layer.
8. The semiconductor device of claim 1 , wherein the contact plug is in a recessed portion of the conductive layer.
9. The semiconductor device of claim 1 , wherein the contact plug extends to an inside of the air gap such that a lower surface of the contact plug is positioned at a height lower than a height of the upper surface of the conductive layer.
10. The semiconductor device of claim 1 , wherein a lower end of the air gap is spaced apart from an upper surface of the substrate.
11. The semiconductor device of claim 10 , wherein a height from the upper surface of the substrate to the lower end of the air gap is equal to 15% or more of a height of the conductive layer.
12. The semiconductor device of claim 1 , further comprising:
a dielectric layer on the upper surface of the conductive layer, wherein
the dielectric layer is exposed through the air gap.
13. The semiconductor device of claim 1 , wherein the conductive layer has a shape in which a width of the conductive layer decreases in proximity to the substrate.
14. The semiconductor device of claim 1 , wherein
a width of the conductive layer increases from the upper surface of the conductive layer to a point at an intermediate depth, and
the width of the conductive layer decreases from the point at the intermediate depth toward the substrate.
15. A semiconductor device, comprising:
a substrate;
a plurality of memory strings spaced apart from each other on the substrate,
the memory strings including two groups of memory strings that are spaced apart from each other,
each of the memory strings including a string selection transistor on a ground selection transistor, and a plurality of memory cells stacked on top of each other between the ground selection transistor and the string selection transistor;
a conductive layer between the two groups of memory strings,
the conductive layer including a trench formed in the conductive layer that opens to a top of the conductive layer and has a depth less than a total height of the conductive layer; and
a contact plug on the conductive layer, the contact plug covering the trench and spaced apart from a bottom of the trench to define an air gap surrounded by the conductive layer.
16. The semiconductor device of claim 15 , further comprising:
an insulating layer between the two groups of memory strings, wherein
the insulating layer defines an open portion that exposes the substrate, and
the conductive layer and the air gap are positioned in the open portion.
17. The semiconductor device of claim 15 , wherein a bottom of the contact plug extends partially into the trench such that the bottom of the contact plug is below an upper surface of the conductive layer.
18. The semiconductor device of claim 15 , further comprising:
a dielectric layer covering inner sidewalls of the conductive layer in the trench, wherein
the dielectric layer is between the contact plug and the bottom of the trench.
19. The semiconductor device of claim 15 , wherein
a width of the air gap is greater at an intermediate portion of the air gap than the width of the air gap at a top portion of the air gap, and
the width of the air gap is greater at the intermediate portion than the width of the air gap at a bottom of the air gap.