Optoelectronic arrangement
View Patent ↗An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.
1. An optoelectronic arrangement comprising a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board,
wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board,
a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and
the first circuit board and the second circuit board connect to one another such that
the surface of the first circuit board faces toward the surface of the second circuit board,
the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface,
the second circuit board comprises an electrical connector, and
an electrical connection element of the electrical connector electrically conductively connects to the first mating contact surface.
2. The optoelectronic arrangement as claimed in claim 1 , wherein the electrical connector is a jack connector, an insulation piercing connection device, a screw contact or a solder pin.
3. The optoelectronic arrangement as claimed in claim 1 ,
wherein the second circuit board comprises a first solder contact surface electrically conductively connected to the first mating contact surface, and
comprises a second solder contact surface electrically conductively connected to the second mating contact surface.
4. The optoelectronic arrangement as claimed in claim 1 , wherein the first circuit board and the second circuit board connect to one another by a resiliently flexible fastener.
5. The optoelectronic arrangement as claimed in claim 1 , wherein the first circuit board and the second circuit board connect to one another by a screw connection.
6. The optoelectronic arrangement as claimed in claim 1 , wherein the first circuit board and the second circuit board connect to one another by a clamp connection.
7. The optoelectronic arrangement as claimed in claim 1 , wherein the first electrical mating contact surface presses against the first electrical contact surface, and the second electrical mating contact surface presses against the second electrical contact surface when the second circuit board and the first circuit board connect to one another.
8. The optoelectronic arrangement as claimed in claim 1 , wherein the optoelectronic arrangement comprises an electrically conductive element arranged between the first mating contact surface and the first contact surface and/or between the second mating contact surface and the second contact surface, when the second circuit board and the first circuit board connect to one another.
9. The optoelectronic arrangement as claimed in claim 1 , wherein the first contact surface, the second contact surface, the first mating contact surface and/or the second mating contact surface comprise a ductile material.
10. The optoelectronic arrangement as claimed in claim 1 , wherein the first circuit board comprises a slot arranged between the first contact surface and the second contact surface, and/or the second circuit board comprises a slot arranged between the first mating contact surface and the second mating contact surface.
11. The optoelectronic arrangement as claimed in claim 1 ,
wherein the first circuit board comprises a third electrical contact surface,
the second circuit board comprises a third electrical mating contact surface, and
the first circuit board and the second circuit board connect to one another such that the third mating contact surface electrically conductively connects to the third contact surface.
12. The optoelectronic arrangement as claimed in claim 1 , wherein the first circuit board is a metal core circuit board.
13. The optoelectronic arrangement as claimed in claim 1 , wherein the second circuit board is an FR4 circuit board.
14. The optoelectronic arrangement as claimed in claim 1 , wherein a further element configured as a thermocouple, an NTC thermistor, an element that measures brightness, an encoding element, or a further optoelectronic semiconductor chip is arranged on the first circuit board.
15. The optoelectronic arrangement as claimed in claim 11 , wherein the third electrical contact surface electrically conductively connects to the further element.
16. The optoelectronic arrangement as claimed in claim 1 , wherein the first electrical contact surface and the second electrical contact surface electrically conductively connect to the optoelectronic semiconductor chip.
17. The optoelectronic arrangement as claimed in claim 1 , wherein a further element comprising drive electronics that drive the optoelectronic semiconductor chip, a protective circuit that protects the optoelectronic semiconductor chip, a monitoring circuit that electrically or thermally monitors the optoelectronic semiconductor chip, a monitor circuit that records a history of the optoelectronic semiconductor chip, and/or an encoding element, is arranged on the second circuit board.
18. An optoelectronic arrangement comprising a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board,
wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board,
the first electrical contact surface and the second electrical contact surface electrically conductively connect to the optoelectronic semiconductor chip,
a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board,
the second circuit board comprises an electrical connector,
an electrical connection element of the electrical connector electrically conductively connects to the first mating contact surface, and
the first circuit board and the second circuit board connect to one another such that
the surface of the first circuit board faces toward the surface of the second circuit board, and
the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.