IP Library Granted Patent US 7,166,186
Granted Patent B2
US 7,166,186 · App. 09/949,736 · Granted Jan 23, 2007

Laser decapsulation apparatus and method

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Quick Facts
Patent No.
US 7,166,186
App. No.
09/949,736
Granted
Jan 23, 2007
Kind
B2
Abstract

A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24. Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned and scanned using an X,Y table 2. A hinged end 4 rotates the device to an acute angle of incidence with respect to a laser 8 . Endpoint detector 10 senses the exposed integrated circuit and moves or shuts down the laser 8.

Claims (1)

1. An apparatus for removing encapsulant from a devise under test (DUT), the apparatus comprising: a chamber having an optical opening, a dispersion fluid inlet and an exhaust outlet, the optical opening adapted to allow a laser to direct a laser beam on a surface of the DUT for removing portions of the encapsulant; a stage in the chamber adapted to receive and hold the DUT, the stage comprising a perforated table to allow debris from the removed portions of the encapsulant to fall through the table into a dust bin in the chamber, the dust bin adapted to collect debris from the removed portions of the encapsulant.

Assignments (1)
SECURITY AGREEMENT Recorded Apr 30, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.; ZILKER LABS, INC.; KENET, INC.; INTERSIL AMERICAS INC.; ELANTEC SEMICONDUCTOR, INC.; D2AUDIO CORPORATION; PLANET ATE, INC.
To: MORGAN STANLEY & CO. INCORPORATED
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