IP Library Granted Patent US 6,896,949
Granted Patent B1
US 6,896,949 · App. 10/096,031 · Granted May 24, 2005

Wafer scale production of optical elements

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Quick Facts
Patent No.
US 6,896,949
App. No.
10/096,031
Granted
May 24, 2005
Kind
B1
Abstract

Improved optical element wafers comprising stacked, optically coupled etalon wafers are disclosed. Each etalon wafer comprises a bulk optic wafer defining the optic cavity between selectively transparent thin film mirror coatings. The bulk optic wafer comprises an optically transparent body, such as a portion of a substrate wafer, along with a wedge correcting coating on at least one of the two surfaces of the optically transparent body and/or a thickness-adjustment layer on one or both surfaces. The bulk optic wafer is a solid, self-supporting body, optically transparent (at the wavelength or wavelengths of interest), whose thickness, i.e., the dimension between the selectively transparent surfaces, defines the cavity spacing of the bulk optic etalon wafer. Methods of making and using the optical element wafers are also disclosed.

Claims (21)

1. An optical element wafer comprising stacked, optically matched and optically coupled etalon wafers, at least one of the optically coupled etalon wafers comprising first and second selectively transparent thin film mirror coatings on opposite first and second surfaces, respectively, of a bulk optic wafer having a diameter of at least 1 inch, the bulk optic wafer comprising an optically transparent body and the bulk optic wafer defining the cavity spacing of the etalon wafer, wherein the bulk optic wafer further comprises a wedge coating overlying the optically transparent body.

2. The optical element wafer of claim 1 , wherein the wedge coating and the optically transparent body are formed of substantially the same material.

3. The optical element wafer of claim 1 , wherein the wedge coating is formed of material comprising a similar refractive index as material comprising the optically transparent body.

4. The optical element wafer of claim 3 , wherein differences in refractive index of the material comprising the wedge coating and the material comprising the optically transparent body is less than about ±0.01.

5. The optical element wafer of claim 1 , wherein the wedge coating at its thickest point has a thickness of less than about 100 nm.

6. The optical element wafer of claim 1 , wherein the bulk optic wafer further comprises a thickness-adjustment layer overlying the optically transparent body.

7. The optical element wafer of claim 6 , wherein the thickness-adjustment layer has a substantially uniform thickness greater than 0 and less than 100 microns.

8. The optical element wafer of claim 6 , wherein the thickness-adjustment layer and the optically transparent body are formed of substantially the same material.

9. The optical element wafer of claim 6 , wherein the thickness-adjustment layer is formed of material comprising a similar refractive index as material comprising the optically transparent body.

10. The optical element wafer of claim 9 , wherein differences in refractive index of the material comprising the thickness-adjustment layer and the material comprising the optically transparent body is less than about ±0.01.

11. An optical element wafer comprising stacked, optically matched and optically coupled etalon wafers, at least one of the optically coupled etalon wafers comprising first and second selectively transparent thin film mirror coatings on opposite first and second surfaces, respectively, of a bulk optic wafer having a diameter of at least 1 inch, the bulk optic wafer comprising an optically transparent body and the bulk optic wafer defining the cavity spacing of the etalon wafer, wherein each of the optically coupled etalon wafers is spaced from an adjacent one of the optically coupled etalon wafers a distance equal to an odd number of QWOTs.

12. An optical element wafer comprising stacked, optically matched and optically coupled etalon wafers, at least one of the optically coupled etalon wafers comprising first and second selectively transparent thin film mirror coatings on opposite first and second surfaces, respectively, of a bulk optic wafer having a diameter of at least 1 inch, the bulk optic wafer comprising an optically transparent body and the bulk optic wafer defining the cavity spacing of the etalon wafer, wherein each of the optically coupled etalon wafers is spaced from an adjacent one of the optically coupled etalon wafers a distance equal to substantially zero QWOTs.

13. An optical element wafer comprising stacked, optically matched and optically coupled etalon wafers, at least one of the optically coupled etalon wafers comprising first and second selectively transparent thin film mirror coatings on opposite first and second surfaces, respectively, of a bulk optic wafer having a diameter of at least 1 inch, the bulk optic wafer comprising an optically transparent body and the bulk optic wafer defining the cavity spacing of the etalon wafer, further comprising a bonding layer attaching a first etalon wafer of the optically coupled etalon wafers to an adjacent etalon wafer.

14. The optical element wafer of claim 13 , wherein the bonding layer is in an optical path through the optically coupled etalon wafers and optically couples the first etalon wafer to the adjacent etalon wafer.

15. The optical element wafer of claim 13 , wherein the bonding layer is substantially out of an optical path through the optically coupled etalons.

16. The optical element wafer of claim 13 , wherein the bonding layer comprises a material selected from the group consisting of adhesives, epoxies, and fritted glass.

17. The optical element wafer of claim 13 , wherein the bonding layer comprises spacer beads in an adhesive, a mono-layer of the spacer beads establishing the adhesive thickness between the first etalon wafer and the adjacent etalon wafer.

18. The optical element wafer of claim 13 , wherein the bonding layer comprises fritted glass.

19. An optical element wafer comprising stacked, optically matched and optically coupled etalon wafers, at least one of the optically coupled etalon wafers comprising first and second selectively transparent thin film mirror coatings on opposite first and second surfaces, respectively, of a bulk optic wafer having a diameter of at least 1 inch, the bulk optic wafer comprising an optically transparent body and the bulk optic wafer defining the cavity spacing of the etalon wafer, wherein a first etalon wafer of the optically coupled etalon wafers is attached to, and spaced from, an adjacent etalon wafer by stand-offs.

20. The optical element wafer of claim 19 , wherein the stand-offs are not in an optical path through the optically coupled etalons.

21. The optical element wafer of claim 20 , wherein the stand-offs are formed of fritted glass.

Assignments (15)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2019
From: II-VI INCORPORATED
To: II-VI DELAWARE, INC.
Reel/Frame 051210/0411 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
CHANGE OF NAME Recorded Aug 14, 2019
From: OCLARO TECHNOLOGY LIMITED
To: LUMENTUM TECHNOLOGY UK LIMITED
Reel/Frame 050046/0260 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2013
From: OCLARO TECHNOLOGY LTD.
To: II-VI INCORPORATED
Reel/Frame 029744/0658 →
RELEASE OF SECURITY INTEREST Recorded Feb 4, 2013
From: WELLS FARGO CAPITAL FINANCE, INC.
To: OCLARO, INC.
Reel/Frame 029744/0635 →
CHANGE OF NAME Recorded Jan 11, 2013
From: BOOKHAM (US) INC.
To: OCLARO TECHNOLOGY, INC.
Reel/Frame 029635/0889 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2013
From: OCLARO TECHNOLOGY, INC.
To: OCLARO TECHNOLOGY, LTD.
Reel/Frame 029635/0859 →
SECURITY AGREEMENT Recorded Nov 15, 2006
From: BOOKHAM TECHNOLOGY, PLC
To: WELLS FARGO FOOTHILL, INC.
Reel/Frame 018524/0089 →
CHANGE OF NAME Recorded Jan 26, 2005
From: BOOKHAM TECHNOLOGY, INC.
To: BOOKHAM (US) INC.
Reel/Frame 015609/0718 →
CHANGE OF NAME Recorded Jan 26, 2005
From: BOOKHAM TECHNOLOGY, INC.
To: BOOKHAM (US) INC.
Reel/Frame 015608/0452 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2005
From: CIERRA PHOTONICS INC.
To: BOOKHAM TECHNOLOGY, INC.
Reel/Frame 015601/0290 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2003
From: CIERRA PHOTONICS INC.
To: BOOKHAM TECHNOLOGY, INC.
Reel/Frame 013804/0260 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2002
From: SCOBEY, MICHAEL A.; GHISLAIN, LUCIEN P.; DERICKSON, DENNIS J.; STOKES, LOREN F.
To: CIERRA PHOTONICS, INC.
Reel/Frame 013090/0015 →