Three-dimensional nonwoven substrate for circuit board
View Patent ↗The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.
1. A method of making a support substrate comprising:
a. providing a base substrate;
b. providing a three-dimensional foraminous surface;
c. providing a resinous matrix;
d. advancing said base substrate onto said three-dimensional base substrate;
e. hydroentangling said base substrate onto said three-dimensional foraminous surface so as to impart said substrate with a corresponding three-dimensional image; and
f. applying said resinous matrix onto said base substrate, said base substrate exhibiting a plurality of interconnected regions of different density or composition, said base substrate exhibiting a dielectric value that is fixed within any one of the interconnected regions.
2. A method of making a support substrate in accordance with claim 1 , wherein said base substrate is selected from the group consisting of staple length fibers, continuous filaments, and blends thereof.
3. A method of making a support substrate in accordance with claim 2 , wherein base substrate is selected from the group comprising thermoplastic fibers, natural fibers, thermoset fiber, and the combination thereof.
4. A method of making a support substrate in accordance with claim 3 , wherein said thermoplastic fibers are selected from the group comprising polyolefins, polyamides, polyesters and the combinations thereof.
5. A method of making a support substrate in accordance with claim 3 , wherein said natural fibers are selected from the group comprising cotton, wood pulp, viscose rayon, flax, hemp, kenaf, and the combinations thereof.
6. A support substrate for electronic circuitry formed in accordance with the method of claim 1 .
7. A support substrate in accordance with claim 6 , wherein said support substrate comprises a portion that is removable.
8. A support substrate in accordance with claim 7 , wherein said removable portion of said support substrate may be repositioned within said support substrate.
9. A support substrate as in claim 6 , wherein said substrate is comprised of at least one aperture.
10. A support substrate as in claim 6 , wherein said support substrate is comprised of at least one increased localized thermal mass protruding from said substrate.
11. A support substrate as in claim 6 , wherein said support substrate is comprised of integrated spacers of the same scale or of differing scales that protrude from said substrate.
12. A support substrate as in claim 6 , wherein said support substrate is comprised of structural reinforcements that protrudes from said substrate.
13. A support substrate as in claim 12 , wherein said structural reinforcement is comprised of at least one aperture.
14. A support substrate as in claim 6 , wherein said support substrate is comprised of wiring channels that are embedded within the surface of said substrate.
15. A support substrate as in claim 6 , wherein said support substrate is comprised of a live hinge.
16. A support substrate as in claim 6 , wherein said support substrate is comprised of an air-transfer grill.