IP Library Granted Patent US 6,849,914
Granted Patent B2
US 6,849,914 · App. 10/283,466 · Granted Feb 1, 2005

Thermo-optic semiconductor device

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Quick Facts
Patent No.
US 6,849,914
App. No.
10/283,466
Granted
Feb 1, 2005
Kind
B2
Abstract

A thermo-optic semiconductor device has one semiconductor region providing an optical waveguide and an adjacent semiconductor region providing a resistive heater between two doped regions, current may be passed through the resistive heater within the adjacent semiconductor region to heat it and thereby vary the optical characteristics of the waveguide.

Claims (12)

1. A thermo-optic semiconductor device comprising a semiconductor layer in which a waveguide is defined and including two doped regions providing a resistive heater therebetween, said two doped regions being both P-type doped regions or being both N-type doped regions, and being in electrical contact with external contact regions so that current may be passed through the resistive heater to generate heat within the semiconductor layer and thereby vary the optical characteristics of the waveguide.

2. A thermo-optic electric device according to claim 1 in which said external contact regions comprise metal regions.

3. A device according to claim 2 in which the semiconductor layer is covered with an electrically insulating layer and said metal regions are exposed through said insulating layer.

4. A device according to claim 1 in which the resistive heater provides a phase shifter for light transmitted through the waveguide.

5. A device according to claim 1 in which the semiconductor layer includes a main region and an elongated channel region above the main region, and said doped regions are located on opposite sides of the channel region.

6. A device according to claim 1 in which the semiconductor layer is a layer of epitaxial silicon.

7. A device according to claim 1 in which the device is integrated on a silicon or silicon-on-insulator chip.

8. A device according to claim 1 in which the doped regions each comprise P-typed doped regions within the semiconductor.

9. A device according to claim 1 in which the doped regions each comprise N-typed doped regions within the semiconductor.

10. A device according to claim 1 , where said resistive heater extends through the waveguide.

11. A device according to claim 1 , wherein said waveguide is a rib waveguide.

12. A light modulator comprising an optical transmission device for splitting an optical beam and directing part of the optical beam through a thermo-optic device for recombining the beam to cause amplitude modulation by interference, said thermo-optic device comprising a semiconductor layer in which a waveguide is defined and including two doped regions providing a resistive heater therebetween, said two doped regions being both P-type doped regions or being both N-type doped regions, and being in electrical contact with external contact regions so that current may be passed through the resistive heater to generate heat within the semiconductor layer and thereby vary the optical characteristics of the waveguide.

Assignments (6)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO TECHNOLOGY LIMITED
To: LUMENTUM TECHNOLOGY UK LIMITED
Reel/Frame 049783/0871 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 15, 2015
From: BOOKHAM TECHNOLOGY PLC; OCLARO TECHNOLOGY PLC
To: OCLARO TECHNOLOGY LIMITED
Reel/Frame 035705/0808 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO TECHNOLOGY LIMITED
Reel/Frame 032642/0911 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
SECURITY AGREEMENT Recorded Nov 15, 2006
From: BOOKHAM TECHNOLOGY, PLC
To: WELLS FARGO FOOTHILL, INC.
Reel/Frame 018524/0089 →