IP Library Granted Patent US 6,979,704
Granted Patent B1
US 6,979,704 · App. 10/283,585 · Granted Dec 27, 2005

Optical polymer blend with bimodal particle sizes

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Quick Facts
Patent No.
US 6,979,704
App. No.
10/283,585
Granted
Dec 27, 2005
Kind
B1
Abstract

An optical polymer blend includes sub-wavelength particles to modify the refractive index of a polymer to match the refractive index of micro-particles added to adjust the bulk coefficient of thermal expansion of the blend. A relatively large amount of material may be added to the resin to adjust the bulk coefficient of thermal expansion without unduly increasing the viscosity of the blend before setting. In some applications blends are used for molded or extruded optical elements, in other applications, blends are used for optical adhesives with low coefficients of thermal expansion.

Claims (27)

1. A resin blend comprising:

a matrix including

a resin with a first refractive index, and

a plurality of nano-particles having a second refractive index, the matrix having an intermediate refractive index between the first refractive index and the second refractive index; and

a plurality of micro-particles having a third refractive index, the intermediate refractive index being closer to the third refractive index than the first refractive index is to the third refractive index.

2. The resin blend of claim 1 wherein a first absolute difference between the first refractive index and the third refractive index is greater than 0.001 at a selected wavelength, and a second absolute difference between the intermediate refractive index and the third refractive index is less than or equal to 0.001 at the selected wavelength.

3. The resin blend of claim 1 wherein the micro-particles have a negative coefficient of thermal expansion.

4. The resin blend of claim 3 wherein the micro-particles include a chemically modified surface layer.

5. The resin blend of claim 3 wherein the micro-particles comprise glass.

6. The resin blend of claim 1 wherein the micro-particles have a first positive coefficient of thermal expansion and the resin has a second positive coefficient of thermal expansion, the first positive coefficient of thermal expansion being less than the second positive coefficient of thermal expansion.

7. The resin blend of claim 1 wherein the resin is selected from the group consisting of polycarbonate resin, acrylic resin, epoxy resin, urethane resin, perfluoroether resin, and nylon resin.

8. The resin blend of claim 1 wherein the resin is a thermosetting resin.

9. The resin blend of claim 1 wherein the resin is an epoxy resin and the resin blend has a coefficient of thermal expansion less than 50 parts-per-million and the resin has a first light transmission, the resin blend has a second light transmission and a difference between the first light transmission and the second light transmission is not greater than 5% of the first light transmission.

10. The resin blend of claim 1 wherein the plurality of nano-particles compose between 10 vol. % and 34 vol. % of the resin blend.

11. The resin blend of claim 1 wherein the plurality of nano-particles has a mean particle size between 2 nanometers and 3 microns.

12. The resin blend of claim 1 wherein the plurality of micro-particles comprises material having a coefficient of thermal expansion less than 20 parts-per-million.

13. The resin blend of claim 1 wherein the plurality of nano-particles comprises material selected from the group consisting of SiO 2 , TiO 2 , ZrO 2 , BaSO 4 , Al 2 O 3 , mixed metal oxides, metal sulfides, mixed metal oxides and sulfides, inorganic salts of organic acids, semiconductor or metallic elements associated with organic ligands, and polymers.

14. The resin blend of claim 1 wherein the plurality of micro-particles compose at least 30 vol. % of the resin blend.

15. The resin blend of claim 1 wherein the matrix has a first coefficient of thermal expansion and the resin blend has a second coefficient of thermal expansion, the second coefficient of thermal expansion being not greater than 70% of the first coefficient of thermal expansion.

16. A method of making a resin blend, the method comprising:

mixing nano-particles having a first index of refraction with resin having a second index of refraction to form a matrix having an intermediate index of refraction; and

mixing micro-particles with the nano-particles and the resin to adjust a coefficient of thermal expansion of the resin blend.

17. The method of claim 16 wherein the resin is a two-part resin and the nano-particles are mixed with a first part of the two-part resin.

18. The method of claim 17 wherein the micro-particles are mixed with the first part of the two-part resin before the first part of the two-part resin is mixed with a second part of the two-part resin.

19. The method of claim 17 wherein the micro-particles are mixed with a second part of the two-part resin before the first part of the two-part resin is mixed with the second part of the two-part resin.

20. The method of claim 16 further comprising a step, before the step of mixing micro-particles, of treating the micro-particles to promote adhesion of the micro-particles with the resin.

21. A resin blend made according to the method of claim 16 .

Assignments (6)
TERMINATIONS OF SECURITY INTEREST AT REEL 052729, FRAME 0321 Recorded Jan 5, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: VIAVI SOLUTIONS INC.; RPC PHOTONICS, INC.
Reel/Frame 058666/0639 →
SECURITY INTEREST Recorded May 21, 2020
From: VIAVI SOLUTIONS INC.; 3Z TELECOM, INC.; ACTERNA LLC; ACTERNA WG INTERNATIONAL HOLDINGS LLC; VIAVI SOLUTIONS LLC; JDSU ACTERNA HOLDINGS LLC; OPTICAL COATING LABORATORY, LLC; RPC PHOTONICS, INC.; TTC INTERNATIONAL HOLDINGS, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 052729/0321 →
CHANGE OF NAME Recorded May 14, 2020
From: JDS UNIPHASE CORPORATION
To: VIAVI SOLUTIONS INC.
Reel/Frame 052671/0870 →
SECURITY AGREEMENT Recorded Feb 26, 2009
From: TRIFORMIX, INC.
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 022320/0530 →
SECURITY AGREEMENT Recorded Feb 4, 2009
From: TRIFORMIX, INC.
To: AGILITY CAPITAL, LLC
Reel/Frame 022203/0113 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2004
From: MAYER, THOMAS; CORLESS, JOHN D.; GOODMAN, TIMOTHY DOUGLAS
To: JDS UNIPHASE CORPORATION
Reel/Frame 015148/0626 →