Thermosetting inorganic clay nanodispersions and their use
View Patent ↗This invention relates to thermosetting inorganic clay nanodispersions comprising an inorganic clay and at least one organometallic compound. The thermosetting inorganic clay nanodispersions are used to prepare thermosetting articles.
1. A thermosetting inorganic clay nanodispersion comprising an inorganic clay having more than one layer and an organometallic compound selected from the group consisting of zinc acrylate stearate, zinc diacrylate, zinc dimethacrylate, calcium diacrylate, and mixtures thereof in an amount sufficient to partially or totally intercalate the layers of inorganic clay.
2. The thermosetting clay nanodispersion of claim 1 wherein the inorganic clay is treated by ion exchange prior to the addition of the organometallic compound.
3. The thermosetting inorganic clay nanodispersion of claim 2 wherein the nanodispersion is prepared in situ by contacting the inorganic clay with a mixture of the organometallic compound and an intercalation facilitating agent.
4. The thermosetting inorganic clay nanodispersion of claim 3 wherein the intercalation facilitating agent is a monomer and/or resin that is compatible with the inorganic clay.
5. The thermosetting inorganic clay nanodispersion of claim 4 wherein the inorganic clay is montmorillonite clay.
6. The thermosetting inorganic clay nanodispersion of claim 5 wherein the intercalation facilitating agent is selected from the group consisting of styrene monomer, acrylic monomer, epoxy resins, and polyols.
7. The thermosetting inorganic clay nanodispersion comprising the inorganic clay nanodispersion of claim 1 , 2 , 3 , 4 , 5 , or 6 and a curative.
8. The thermosetting inorganic clay nanodispersion comprising the inorganic clay nanodispersion of claim 7 and a curative.
9. The thermosetting inorganic clay nanodispersion of claim 8 wherein styrene is used as the agent that facilitates intercalation, an unsaturated polyester is used as the curative, and a peroxide is used as the catalyst at elevated temperatures.
10. The thermosetting inorganic nanodispersion of claim 8 wherein an epoxy resin is used as the resin that facilitates intercalation and a polyamide is used as the curative with a tertiary amine as a catalyst.
11. The thermosetting inorganic nanodispersion of claim 8 wherein a polyol is used as the resin that facilitates intercalation, an organic polyisocyanate is used as the as the curative, and a tertiary amine is used as the catalyst.
12. The thermosetting inorganic nanodispersion of claim 8 wherein an epoxy resin is used as the resin that facilitates intercalation, a polyfunctional amine is used as the curative.
13. A molding composition comprising the thermosetting inorganic nanodispersion of claim 8 and a filler.
14. A molding composition comprising the thermosetting inorganic nanodispersion of claim 9 and a filler.
15. A molding composition comprising the thermosetting inorganic nanodispersion of claim 10 and a filler.
16. A molding composition comprising the thermosetting inorganic nanodispersion of claim 11 and a filler.
17. A molding composition comprising the thermosetting inorganic nanodispersion of claim 12 and a filler.
18. The molding composition of claim 13 , which further comprises a low profile additive.
19. The molding composition of claim 14 , which further comprises a low profile additive.
20. The molding composition of claim 15 , which further comprises a low profile additive.
21. The molding composition of claim 16 which further comprises a low profile additive.
22. The molding composition of claim 17 which further comprises a low profile additive.
23. The molding composition of claim 18 which further comprises a low profile additive.
24. The molding composition of claim 18 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from 15to 40 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.
25. The molding composition of claim 19 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from15 to 4 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.
26. The molding composition of claim 20 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from 15 to 40 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.
27. The molding composition of claim 21 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from 15 to 40 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.
28. The molding composition of claim 22 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from 15 to 40 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.
29. The molding composition of claim 23 comprising:
(a) from 30 to 50 parts of thermosetting resin;
(b) from 1 to 10 parts of treated inorganic clay;
(c) from 10 to 40 parts of a low profile additive;
(d) from 15 to 40 parts of fiber glass; and
(e) from 0 to 65 parts of an inorganic filler,
wherein said parts by weight are based on 100 parts of molding composition.