IP Library › Granted Patent US 7,196,355
Granted Patent B2
US 7,196,355 · App. 10/519,334 · Granted Mar 27, 2007

Integrated thermal sensor for optoelectronic modules

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Quick Facts
Patent No.
US 7,196,355
App. No.
10/519,334
Granted
Mar 27, 2007
Kind
B2
Abstract

An optoelectronic module comprising at least one optical component placed on a support, said component comprising an active optical layer and at least one confinement layer which carries at least one electrical contact, wherein said module further comprises a thermal sensor comprising a temperature-dependent resistive material which extends over the confinement layer of the optical component, at the side of the electrical contact of said component.

Claims (12)

1. An optoelectronic module comprising:

at least one optical component placed on a support, said component comprising an active optical layer,

at least one confinement layer, and

at least one electrical contact contacting the confinement layer, characterized in that said module further comprises a thermal sensor comprising a temperature-dependent resistive material which extends over the at least one confinement layer, at the side of the electrical contact.

2. The optical module according to claim 1 , wherein the thermal sensor comprises a wire of temperature-dependent resistive material which extends between two separate electrical contact areas of the at least one electrical contact.

3. The optical module according to claim 1 , wherein the resistive material contains platinum.

4. The optical module according to claim 1 , wherein the resistive material contains nickel.

5. The optical module according to claim 1 4 , wherein the resistive material contains copper.

6. The optical module according to claim 1 , wherein the support comprises a cooling member which regulates the temperature of the optical component as a function of temperature variations measured by the thermal sensor.

7. The optical module according to claim 1 , further comprising means for regulating the electrical control of the component as a function of temperature variations measured by the thermal sensor.

8. The optical module according to claim 1 , wherein the optical component is a laser.

9. The optical module according to claim 1 , wherein the optical component is a modulator.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0769 →