Constant pH polish and scrub
View Patent ↗A system and method are provided that maintains a high pH at the wafer surface through the entire polish process and then lowers the pH only when necessary in a controlled fashion after CMP and during the post-polish clean. A fluid having a high pH chemistry and, optionally, surfactants is used instead of deionized water to keep the wafer and polisher components wet and to clean the slurry residue from the polishing pad.
1. A chemical mechanical planarization system, comprising:
a wafer input/output area including a wet transfer mechanism, for transferring a first wafer to a first polishing platen and to a second polishing platen using said wet transfer mechanism, said wet transfer mechanism including a pH adjusted solution, having a high pH, to keep said first wafer wet;
a first polishing platen for polishing said first wafer, said first polishing platen including a first high pH slurry source and a first high pH solution rinse source;
a second polishing platen for polishing said first wafer, said second polishing platen including a second high pH slurry source and a second high pH solution rinse source;
a low pH rinsing station including a rinse solution having a lower pH than said pH adjusted solution; and
wherein the pH at the surface of said first wafer is maintained substantially constant during processing on said first and second platens and during transfer therebetween.
2. The system of claim 1 wherein, said high pH slurry has a pH of between 10 and 12.
3. The system of claim 1 wherein, said pH adjusted solution has a pH of between 10 and 12.
4. The system of claim 3 , wherein, pH adjusted solution has a pH of around 11.
5. The system of claim 3 , wherein, said pH adjusted solution includes dilute ammonia.
6. The system of claim 1 , wherein, said rinse solution has a pH of around 6.
7. The system of claim 6 , wherein, said rinse solution is deionized water.
8. The system of claim 7 , wherein said low pH rinsing station is located at a drying station.
9. The system of claim 1 , additionally including:
at least one brush scrubber, wherein said first wafer is scrubbed with said at least one brush scrubber that sprays said first wafer with a high pH solution while scrubbing said first wafer, prior to rinsing said first wafer with a lower oil solution.
10. The system of claim 1 wherein less slurry is used on said second platen than is used in a system wherein deionized water is used to rinse said first wafer on said first platen.