IP Library Granted Patent US 7,252,218
Granted Patent B2
US 7,252,218 · App. 10/738,402 · Granted Aug 7, 2007

Bipolar plate fabrication by roll bonding

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Quick Facts
Patent No.
US 7,252,218
App. No.
10/738,402
Granted
Aug 7, 2007
Kind
B2
Abstract

An anti-bonding material is placed in a desired pattern onto a first sheet of conductive material. A second sheet of conductive material is roll bonded with the first sheet of material. Fluid is injected between the bonded first and second sheets of material to expand the sheets of material at the desired pattern. A flow channel is formed at the desired pattern between the first and second sheet during fluid injection.

Claims (41)

1. A method for making a current collector plate comprising:

providing a first sheet of material having a first bonding face and a first outer face;

providing a second sheet of material having a second bonding face and a second outer face;

creating a plurality of patterned areas on at least one of said first bonding face and said second bonding face;

bonding said first and second sheets together; and

injecting fluid between said first and second sheets thereby causing said first sheet to project outward at said plurality of patterned areas wherein a first anode fluid flow channel having a defined inlet and outlet is defined on said first outer face and wherein a second self-contained coolant fluid flow channel is defined between said first and second sheets at said plurality of patterned areas, wherein said first and second anode and self-contained coolant flow channels do not connect.

2. The method of claim 1 wherein forming a plurality of patterned areas includes placing an anti-bonding material compatible for fuel cell use on at least one of said first bonding face and said second bonding face, and defining bonding areas at the remaining areas of said first bonding face and said second bonding face.

3. The method of claim 2 wherein bonding further includes:

contacting said first bonding face with said second bonding face; and

imposing a force onto at least one of said first and second outer face thereby joining said first and second sheets at said bonding area.

4. The method of claim 3 wherein contacting said first bonding face with said second bonding face defines a first thickness; and

joining said first and second sheets at said bonding area defines a second thickness, said second thickness less than said first thickness.

5. The method of claim 4 wherein imposing a force includes roll bonding said first and second sheets together.

6. The method of claim 1 wherein injecting fluid further comprises:

placing said first and second bonded sheets into a die having spaced apart first and second boundaries; and

injecting fluid between said first and second bonded sheets whereby extension portions contact one of said first and second boundaries so as to form a flat surface thereat.

7. The method of claim 1 , further comprising applying a conductive coating onto said first and second outer face.

8. A method for making a current collector plate comprising:

placing an anti-bonding material onto a first surface of a first sheet of material in a predetermined pattern thereby forming patterned areas defined by said anti-bonding material and adjacent non-patterned areas;

contacting a second sheet of material with said anti-bonding material;

forming a metallurgical bond between said first and second sheets at said non-patterned areas thereby creating a two-piece bonded plate; and

introducing fluid between said two-piece bonded plate to cause said first sheet to project outward defining projected portions at said patterned area wherein a first anode fluid flow channel having a defined inlet and outlet is defined on a first outer face of said first sheet of material and wherein a second self-contained coolant fluid flow channel is defined between said first and second sheets of material at said patterned area, wherein said first and second anode and self-contained flow channels do not connect.

9. The method of claim 8 wherein introducing fluid further comprises:

placing said two-piece bonded plate into a die having a first boundary and a second boundary; and

injecting fluid between said two-piece bonded plate whereby said projected portions contact one of said first boundary and said second boundary so as to form a flat surface thereat.

10. The method of claim 8 wherein forming a metallurgical bond includes roll bonding said first and second sheet together.

11. The method of claim 8 , further comprising rolling said first and second sheet from a rolled stock of material.

12. The method of claim 8 , further comprising applying a conductive coating onto an outer face of said respective first and second sheet.

13. A method for making a current collector plate comprising:

providing a first sheet of conductive material;

providing a second sheet of conductive material;

placing an anti-bonding material in a desired pattern over a bonding surface of said first sheet of conductive material, said pattern of anti-bonding material defining an anti-bonding area along said first sheet, wherein the remaining surface of said bonding surface absent said anti-bonding material defines a bonding area;

contacting said second sheet of conductive material with said anti-bonding material of said first sheet of conductive material;

roll bonding said first and second sheets together whereby said first and second sheets form a metallurgical bond therebetween at said bonding area and defining a two-piece bonded plate; and

injecting fluid between said first and second bonded sheets whereby said anti-bonding area is expanded outwardly defining expanded portions along said desired pattern wherein a first anode fluid flow channel is defined on a first outer face of said two-piece bonded place, a second self-contained coolant fluid flow channel is defined through said expanded portions, and a third cathode fluid flow channel is defined on a second outer face of said two-piece bonded plate, wherein said first anode flow channel, said second self-contained coolant flow channel and third cathode flow channels do not connect, and wherein said first anode flow channel, said second self-contained coolant flow channel and third cathode flow channels each provide a defined inlet and outlet, respectively.

14. The method of claim 13 wherein injecting fluid further comprises:

placing said first and second bonded sheets into a die having a first and second boundary; and

injecting fluid between said first and second bonded sheets whereby said expanded portions contact one of said first and second boundary so as to form a flat surface thereat.

15. The method of claim 1 wherein injecting fluid further causes said second sheet of material to project outward wherein a third cathode flow channel is defined on said second outer face.

16. The method of claim 8 wherein introducing fluid further causes said second sheet of material to project outward wherein a third cathode flow channel is defined on a second outer face of said second sheet of material.

17. The method of claim 2 , wherein the anti-bonding material comprises colloidal graphite.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034371/0676 →
CHANGE OF NAME Recorded Feb 10, 2011
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 025780/0902 →
SECURITY AGREEMENT Recorded Nov 8, 2010
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: WILMINGTON TRUST COMPANY
Reel/Frame 025327/0262 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025245/0347 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UAW RETIREE MEDICAL BENEFITS TRUST
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025311/0725 →
SECURITY AGREEMENT Recorded Aug 28, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UAW RETIREE MEDICAL BENEFITS TRUST
Reel/Frame 023161/0911 →
SECURITY AGREEMENT Recorded Aug 27, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 023156/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2009
From: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023127/0468 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2009
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023124/0429 →
SECURITY AGREEMENT Recorded Apr 16, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
Reel/Frame 022553/0446 →
SECURITY AGREEMENT Recorded Feb 4, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 022201/0547 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2009
From: GENERAL MOTORS CORPORATION
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 022102/0533 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2003
From: GAYDEN, XIAOHONG; CHEN, YEN-LUNG; SIGLER, DAVID R.
To: GENERAL MOTORS CORPORATION
Reel/Frame 014818/0639 →