Optimized heat sink using high thermal conducting base and low thermal conducting fins
View Patent ↗An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 3 times that of the base, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
1. A low profile composite heat sink apparatus, comprising:
a base having a length, a width and a thickness, the base being constructed of an anisotropic graphite material having a higher thermal conductivity in the directions of the length and width than the graphite material has in the direction of the thickness; and
a plurality of fins constructed of a material having a thermal conductivity in the plane of the fins of less than about 100 W/m° K, the fins having a height above the base of no greater than about 3 times the height of the base.
2. The apparatus of claim 1 , wherein:
the fins are constructed of a thermally conductive plastic material.
3. The apparatus of claim 1 , wherein:
the fins have a height above the base in a range of no greater than about 15 mm.