IP Library Granted Patent US 7,102,888
Granted Patent B2
US 7,102,888 · App. 10/828,396 · Granted Sep 5, 2006

Electronically integrated vehicle structure

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Quick Facts
Patent No.
US 7,102,888
App. No.
10/828,396
Granted
Sep 5, 2006
Kind
B2
Abstract

An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

Claims (39)

1. An integrated vehicle structure comprising:

an electronic site having a flexible substrate with electronic components mounted on the flexible substrate;

a plastic support structure defining a plastic mounting surface, the plastic support structure including a plurality of elongated ribs projecting from the plastic support structure and extending along side each other, each of the ribs having a side edge forming a portion of the plastic mounting surface;

the flexible substrate being mounted to the plastic mounting surface; and

a plurality of air flow passageways defined by adjacent ribs and the flexible substrate mounted to the adjacent ribs, the plurality of air flow passageways extending along the plastic support structure to provide convective cooling to the electronic components of the electronic site.

2. The integrated vehicle structure of claim 1 , wherein the plastic mounting surface is vertically oriented.

3. The integrated vehicle structure of claim 2 , wherein the air flow passageways extend vertically.

4. The integrated vehicle structure of claim 2 , wherein the ribs and air flow passageways extend from an upper end of the plastic mounting surface to a lower end of the plastic mounting surface.

5. The integrated vehicle structure of claim 4 , wherein the air flow passageways are unobstructed from the upper end to the lower end.

6. The integrated vehicle structure of claim 1 , wherein the electronic site has electronic components mounted to both sides of the flexible substrate, and wherein a portion of the electronic components are positioned within one of the plurality of air flow passageways.

7. The integrated vehicle structure of claim 1 , wherein the plastic mounting surface is non-planar.

8. The integrated vehicle structure of claim 1 , further comprising metal blocks positioned in at least one flow passageway to conductively cool an electronic component.

9. The integrated vehicle structure of claim 1 , further comprising a fan providing forced convection in the flow passageways.

10. The integrated vehicle structure of claim 1 , further comprising a cover positioned over plastic support structure to protect the electronic site.

11. The integrated vehicle structure of claim 1 , further comprising a metal support structure defining a metal mounting surface.

12. The integrated vehicle structure of claim 11 , wherein the metal mounting surface is non-planar.

13. The integrated vehicle structure of claim 11 , wherein the metal mounting surface exists in a first plane and the plastic mounting surface exists in a second plane, the first and second planes being generally parallel.

14. The integrated vehicle structure of claim 11 , wherein the two mounting surfaces are co-planar.

15. The integrated vehicle structure of claim 11 , further comprising means for attaching the flexible substrate to the plastic mounting surface, and wherein the attaching means permits movement of the flexible substrate relative to the attaching means to accommodate different coefficients of thermal expansion between the plastic support structure and the metal support structure.

16. The integrated vehicle structure of claim 11 , further comprising a second electronic site having a second flexible substrate with second electronic components mounted to the second flexible substrate, the second electronic site connected to the metal mounting surface.

17. The integrated vehicle structure of claim 16 , wherein the metal mounting surface is flat and the second electronic site is single-sided.

18. The integrated vehicle structure of claim 16 , wherein the metal mounting surface defines a hole and the second electronic site is double side populated, the hole receiving an electronic component.

19. The integrated vehicle structure of claim 16 , wherein the first and second electronic sites are electronically connected by a flexible jumper.

20. The integrated vehicle structure of claim 16 , wherein the metal support structure is a cross car structure of a vehicle.

21. The integrated vehicle structure of claim 11 , wherein the flexible substrate of the electronic site is also mounted to the metal mounting surface of the metal support structure.

22. An integrated vehicle structure comprising:

an electronic site having a flexible substrate with electronic components mounted to the flexible substrate;

a metal support structure defining a metal mounting surface existing in a first plane;

a plastic support structure defining a plastic mounting surface existing in a second plane, the plastic support structure including a plurality of elongated ribs projecting from the plastic support structure and extending along side each other, each of the ribs having a side edge forming a portion of the plastic mounting surface; and

the flexible substrate being mounted to both the plastic mounting surface and the metal mounting surface.

23. The integrated vehicle structure of claim 22 , further comprising a plurality of air flow passageways defined by adjacent ribs and the flexible substrate mounted to the adjacent ribs, the plurality of air flow passageways extending along the plastic support structure to provide convective cooling to the electronic components of the electronic site.

24. The integrated vehicle structure of claim 23 , wherein the ribs and air flow passageways extend from an upper end of the plastic mounting surface to a lower end of the plastic mounting surface.

25. The integrated vehicle structure of claim 24 , wherein the air flow passageways are unobstructed from the upper end to the lower end.

26. The integrated vehicle structure of claim 23 , wherein at least one rib includes an aperture linking adjacent air flow passageways.

27. The integrated vehicle structure of claim 22 , wherein the first and second planes are generally parallel.

28. The integrated vehicle structure of claim 22 , wherein the first and second mounting surfaces are co-planar.

29. The integrated vehicle structure of claim 22 , further comprising means for attaching the flexible substrate to the plastic mounting surface, and wherein the attaching means permits movement of the flexible substrate relative to the attaching means to accommodate different coefficients of thermal expansion between the plastic support structure and the metal support structure.

30. The integrated vehicle structure of claim 22 , wherein the metal support structure is a cross car structure of a vehicle.

31. The integrated vehicle structure of claim 22 , wherein the plastic support structure is a center stack structure.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2014
From: CITIBANK, N.A.
To: VISTEON CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 034144/0674 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Jun 9, 2014
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 033107/0717 →
SECURITY INTEREST Recorded Apr 18, 2014
From: VISTEON CORPORATION, AS GRANTOR; VISTEON GLOBAL TECHNOLOGIES, INC., AS GRANTOR
To: CITIBANK., N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032713/0065 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS ON REEL 025241 FRAME 0317 Recorded Apr 26, 2011
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 026178/0412 →
SECURITY AGREEMENT (REVOLVER) Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025238/0298 →
SECURITY AGREEMENT Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025241/0317 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS RECORDED AT REEL 022575 FRAME 0186 Recorded Oct 7, 2010
From: WILMINGTON TRUST FSB, AS ADMINISTRATIVE AGENT
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 025105/0201 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS RECORDED AT REEL 022974 FRAME 0057 Recorded Oct 6, 2010
From: THE BANK OF NEW YORK MELLON
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 025095/0711 →
ASSIGNMENT OF PATENT SECURITY INTEREST Recorded Jul 17, 2009
From: JPMORGAN CHASE BANK, N.A., A NATIONAL BANKING ASSOCIATION
To: THE BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT
Reel/Frame 022974/0057 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Apr 21, 2009
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: WILMINGTON TRUST FSB, AS ADMINISTRATIVE AGENT
Reel/Frame 022575/0186 →
SECURITY INTEREST Recorded Feb 27, 2009
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK
Reel/Frame 022368/0001 →
SECURITY AGREEMENT Recorded Feb 7, 2008
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 020497/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2004
From: GLOVATSKY, ANDREW Z.; BAKER, JAY D.; MCMILLAN, RICHARD KEITH; LEMECHA, MYRON; VANDERSLUIS, DANIEL ROGER
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 015252/0044 →