IP Library Granted Patent US 7,257,304
Granted Patent B2
US 7,257,304 · App. 10/861,972 · Granted Aug 14, 2007

Integrated optical device with reduced waveguide birefringence

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Quick Facts
Patent No.
US 7,257,304
App. No.
10/861,972
Granted
Aug 14, 2007
Kind
B2
Abstract

Techniques for reducing waveguide birefringence in an integrated planar lightwave circuit chip incorporating a plurality of different optical devices are described and claimed. Each optical device includes waveguides in which the waveguide cores are each disposed on a respective mesa formation formed in a lower cladding layer. In one method, during fabrication of the waveguides, waveguides cores in different devices on the chip are etched to a different depth in a waveguide lower cladding layer, whereby the height of the mesa formation is different in different devices. The different depths are selected to achieve a desired level of waveguide birefringence, preferably minimum waveguide birefringence, in each device. In another technique dummy waveguides are included in one or more devices on the chip in order to optimize the waveguide birefringence in one or more devices for predetermined mesa height(s) used in the chip, or for different mesa heights in the chip.

Claims (18)

1. A method of fabricating an integrated optical component comprising:

providing a substrate, at least a face of the substrate having a first cladding layer disposed thereon;

forming a core material layer on the first cladding layer;

forming a plurality of different optical devices on the substrate, each device comprising a plurality of waveguides, each waveguide comprising a waveguide core formed in the core material layer and disposed on a respective mesa formation formed in the first cladding layer;

selecting an optimum height for the mesa formations in a first said optical device so as to achieve a desired level of waveguide birefringence in said first device, and optimizing the waveguide birefringence of at least one other said optical device so as to obtain a required level of waveguide birefringence in the integrated optical component; and

forming at least one dummy waveguide in at least one of the optical devices, wherein the at least one dummy waveguide is selected so as to achieve a desired level of waveguide birefringence in the optical device in which the dummy waveguides are formed.

2. The method according to claim 1 , wherein each said dummy waveguide is formed at the same time as the other waveguides in the optical devices are being formed.

3. The method according to claim 1 , wherein the mesa formations in each said optical device have the same predetermined height and the number and arrangement of dummy waveguides is selected so as to optimize the waveguide birefringence of at least one said optical device for said predetermined height of the mesa formations, so as to obtain the required level of waveguide birefringence in the integrated optical component.

4. The method according to claim 1 , wherein the height of the mesa formations in the first said optical device is different from the height of the mesa formations in the at least one other said optical device.

5. A method of fabricating an integrated optical component comprising the steps of:

providing a substrate, at least a face of the substrate having a first cladding layer disposed thereon;

forming a core material layer on the first cladding layer;

forming a plurality of different optical devices on the substrate, each device comprising a plurality of waveguides, each waveguide comprising a waveguide core formed in the core material layer and disposed on a respective mesa formation formed in the first cladding layer; wherein

the method includes the step of selecting an optimum height for the mesa formations in a first said optical device so as to achieve a desired level of waveguide birefringence in said first device, and optimizing the waveguide birefringence of at least one other said optical device so as to obtain a required level of waveguide birefringence in the integrated optical component; and

forming all the waveguides in one said device to have a different height of mesa formation to the waveguides in at least one other said device, wherein the respective mesa heights in at least two said optical devices are selected so that the waveguide birefringence in one said device is of substantially equal magnitude but opposite sign to the waveguide birefringence in the other said device.

6. The method according to claim 1 , wherein at least one said dummy waveguide is formed and arranged so as to achieve a minimum level of waveguide birefringence of said at least one optical device for the predetermined mesa height.

7. The method according to claim 1 , wherein the predetermined mesa height is the optimum height to achieve minimum birefringence in another of the optical devices.

8. The method according to claim 1 , wherein the plurality of different optical components comprises at least one AWG having a plurality of said dummy waveguides provided therein, one said dummy waveguide being disposed on each side of each array waveguide of said AWG, and the dummy waveguides are formed and arranged such that the percentage increase in length between one array waveguide and the next array waveguide is substantially the same as the percentage increase in length between one dummy waveguide and the next dummy waveguide.

Assignments (9)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO, INC.
To: LUMENTUM OPTICS INC.
Reel/Frame 049783/0733 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 5, 2014
From: AVANEX CORPORATION
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032826/0276 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0769 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2007
From: HBK INVESTMENTS, L.P.
To: AVANEX CORPORATION
Reel/Frame 019035/0342 →
SECURITY AGREEMENT Recorded May 27, 2005
From: AVANEX CORPORATION
To: HBK INVESTMENTS L.P.
Reel/Frame 016079/0174 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2004
From: BONAR, JAMES RONALD; JUBBER, MICHAEL GEORGE
To: AVANEX CORPORATION
Reel/Frame 015447/0720 →