IP Library Granted Patent US 7,155,102
Granted Patent B2
US 7,155,102 · App. 10/871,298 · Granted Dec 26, 2006

Method and structure of electric field poling of Ti indiffused LiNbO

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Quick Facts
Patent No.
US 7,155,102
App. No.
10/871,298
Granted
Dec 26, 2006
Kind
B2
Abstract

A method and structure are disclosed with a simplified approach for fabricating a LiNbO3 wafer with Ti indiffusion wafeguide on the surface that is domain inverted. The method involves indiffusing Ti into LiNbO 3 with a predefined temperature and time indiffusion range, a Li enriched and dry oxygen atmosphere, which allows making optical waveguides on the z− crystal face without any significant domain inversion occurring on the z+ face of the crystal. This allows for subsequent poling without the need of any additional removal of the thin domain inverted layer which would otherwise appear on the z+ face. Even in instance where a thin domain inversion layer is formed, it is insufficient thick to prevent poling, eliminating the need for the grinding process.

Claims (25)

1. A waveguide fabrication method, comprising:

providing a predefined temperature with a time indiffusion range;

indiffusing Ti into an LiNbO 3 substrate in a furnace at a low temperature in a specified atmosphere; and

forming an optical waveguide on the z− crystal face of the substrate without any domain inversion occurring on the z+ crystal face; and

poling the Ti indiffused LiNbO 3 substrate without having to remove a thin domain inverted layer which would otherwise appear on the z+ crystal face.

wherein the diffusing step comprises indiffusing Ti into the LiNbO 3 substrate in a furnace with a lithium enriched and dry oxygen atmosphere.

2. The method of claim 1 , after the forming step, further comprising applying high voltage pulses via liquid or solid electrodes.

3. The method of claim 1 , further including forming a predefined pattern of insulating material on the z− crystal face.

4. The method of claim 3 , wherein the insulating material is SiO 2 .

5. The method of claim 1 , wherein the predefined temperature is 1030° C.

6. A method for waveguide fabrication process, comprising:

providing a predefined temperature with a time indiffusion range;

indiffusing Ti into an LiNbO 3 substrate in a furnace with a Li/O 2 enriched atmosphere; and

forming an optical waveguide on the z− crystal face without any domain invasion occurring on the z+ crystal face.

7. The method of claim 6 , wherein the step of indiffusing Ti into the LiNbO 3 substrate is performed at a low temperature.

8. The method of claim 7 , after the forming step, further comprising applying high voltage pulses via liquid electrodes.

9. The method of claim 8 , further comprising poling the Ti indiffused LiNbO 3 substrate without the need of removing a thin domain inverted layer which would otherwise appear on the z+ crystal face.

10. The method of claim 6 , wherein the Li/O 2 enriched atmosphere in the furnace substantially prevents Li 2 O out-diffusion.

11. A method for use in forming a waveguide, comprising:

placing at least one LiNbO 3 wafer on tray while flowing oxygen through a tube;

positioning the tray and the at least one LiNbO 3 wafer into the tube and increasing a temperature in the tube to a predetermined temperature while flowing oxygen through the tube;

indiffusing Ti into the LiNbO 3 wafer and forming the waveguide while flowing oxygen through the tube;

reducing the temperature in the tube to a predetermined temperature while flowing oxygen through the tube; and

stopping the flow of oxygen through the tube and removing the tray from the tube.

12. The method of claim 11 , further comprising removing the LiNbO 3 wafer from the tray and poling the Ti indiffused LiNbO 3 wafer without having to remove a thin domain inverted layer which would otherwise appear on the z+ crystal face.

Assignments (10)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO, INC.
To: LUMENTUM OPTICS INC.
Reel/Frame 049783/0733 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 5, 2014
From: AVANEX CORPORATION
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032826/0276 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0413 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2007
From: HBK INVESTMENTS, L.P.
To: AVANEX CORPORATION
Reel/Frame 019035/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2005
From: PRUNERI, VALERIO; LUCCHI, FEDERICO; VERGANI, PAOLO
To: AVANEX CORPORATION
Reel/Frame 016297/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2005
From: PRUNERI, VALERIO; LUCCHI, FEDERICO; VERGANI, PAOLO
To: AVANEX CORPORATION
Reel/Frame 016297/0463 →
SECURITY AGREEMENT Recorded May 27, 2005
From: AVANEX CORPORATION
To: HBK INVESTMENTS L.P.
Reel/Frame 016079/0174 →