IP Library Granted Patent US 7,109,526
Granted Patent B2
US 7,109,526 · App. 10/893,140 · Granted Sep 19, 2006

Semiconductor optical device on an indium phosphide substrate for long operating wavelengths

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Quick Facts
Patent No.
US 7,109,526
App. No.
10/893,140
Granted
Sep 19, 2006
Kind
B2
Abstract

A semiconductor optical device such as a laser or semiconductor optical amplifier (SOA) based on an indium phosphide substrate or equivalent buffer layer. The active layer of the device is based on conventional InGaAs(P) alloy, but additionally includes N in order to increase the operating wavelength to greater than 1.5 μm, preferably to a wavelength lying in the C- or L-band. The active layer composition may thus be denoted In 1-x Ga x As y N z P p with x≧0.48, y≦1−z−p, z≦0.05, p≧0. The active layer may include a quantum well or multi-quantum wells in which case its thickness is preferably less than the critical thickness for lattice relaxation. In other embodiments the active layer is a “massive” layer with quasi-bulk properties. The active layer may advantageously be under tensile stress, preferably roughly between 1% and 2.2%, to manipulate the light and heavy hole bands. The active layer is typically bounded by barrier layers made of a suitable semiconductor alloy, such as AlInAs or InGaAs(P).

Claims (38)

1. A semiconductor optical device comprising:

a substrate based on indium phosphide, and

an active layer having a composition adjusted for an operating wavelength greater than 1.55 μm that comprises:

a gallium concentration x greater than or equal to 0.48;

an indium concentration 1−x;

a phosphorus concentration p;

a nitrogen concentration z less than or equal to 0.05; and

an arsenic concentration y, where y is roughly equal to 1−z−p.

2. The semiconductor optical device according to claim 1 , wherein the active layer has a quantum well and the nitrogen concentration z is between 0.005 and 0.02.

3. The semiconductor optical device according to claim 1 , wherein the active layer is massive and the nitrogen concentration z is between 0.005 and 0.01.

4. The semiconductor optical device according to claim 1 , wherein the gallium concentration x is between 0.5 and 0.75.

5. The semiconductor optical device according to claim 1 , wherein the device is a laser and the composition is such that the active layer has a tensile stress roughly between 1% and 2.2%.

6. The semiconductor optical device according to claim 1 , wherein the device is a laser and the composition is such that the active layer has an energy difference between the centre of the heavy-hole band and the centre of the light-hole band greater than or equal to 40 meV.

7. The semiconductor optical device according to claim 1 , wherein the device is a laser and the composition is such that the active layer has an energy difference between the centre of the heavy-hole band and the centre of the light-hole band greater than or equal to 50 meV.

8. The semiconductor optical device according to claim 1 , wherein the device is a semiconductor amplifier and the composition is such that the active layer has a tensile stress roughly shifted by 0.15% relative to the state of the active layer corresponding to crossing of the centre of the heavy-hole band and the centre of the light-hole band.

9. The semiconductor optical device according to claim 1 , wherein the active layer has a quantum well, with the thickness of the active layer being less than a critical thickness.

10. The semiconductor optical device according to claim 1 , wherein the active layer is of the quantum-well type and is interposed between two barrier layers, the two barrier layers being of a semiconductor alloy based on aluminum, indium and arsenic (AlInAs).

11. The semiconductor optical device according to claim 1 , wherein the active layer is of the quantum-well type and is interposed between two barrier layers, the two barrier layers being of a semiconductor alloy based on indium, arsenic and phosphorus (InAsP).

12. The semiconductor optical device according to claim 1 , wherein the active layer is of the quantum-well type and is interposed between two barrier layers, the two barrier layers being of a semiconductor alloy based on indium, gallium, arsenic and phosphorus (InGaAsP).

13. The semiconductor optical device according to claim 1 , wherein the active layer is of the quantum-well type and is interposed between two hater layers and the quantum-well layer has a given tensile stress, the said barrier layers being of a semiconductor material such that the barrier layers have a compressive stress roughly equal to the tensile stress.

14. The semiconductor optical device according to claim 1 , wherein the operating wavelength is greater or equal to 1.60 μm.

15. The semiconductor device according to claim 14 , wherein the gallium concentration x is between 0.48 and 0.75.

16. The semiconductor device according to claim 14 , wherein the gallium concentration x is 0.60 and the nitrogen concentration z is 0.01.

17. The semiconductor device according to claim 14 , wherein the active layer is disposed between two hater layers which have a compressive stress roughly equal to a tensile stress.

18. A semiconductor optical device comprising:

a substrate based on indium phosphide, and

an active layer having a composition adjusted for an operating wavelength of at least 1.60 μm that comprises:

a gallium concentration x greater than or equal to 0.48;

an indium concentration 1−x;

a nitrogen concentration z less than or equal to 0.05; and

an arsenic concentration y, where y is roughly equal to 1−z.

19. A semiconductor optical device comprising:

a substrate based on indium phosphide, and

an active layer having a composition adjusted for an operating wavelength greater than 1.60 μm that comprises:

a gallium concentration x greater than or equal to 0.48;

an indium concentration 1−x;

a nitrogen concentration z less than or equal to 0.05; and

an arsenic concentration y, where y is roughly equal to 1−z, wherein the composition can be adjusted so that the active layer has an energy difference between the centre of the heavy-hole band and the centre of the light-hole band greater than or equal to 40 meV and preferably to 50 meV.

Assignments (9)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO, INC.
To: LUMENTUM OPTICS INC.
Reel/Frame 049783/0733 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 5, 2014
From: AVANEX CORPORATION
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032826/0276 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0413 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2007
From: HBK INVESTMENTS, L.P.
To: AVANEX CORPORATION
Reel/Frame 019035/0342 →
SECURITY AGREEMENT Recorded May 27, 2005
From: AVANEX CORPORATION
To: HBK INVESTMENTS L.P.
Reel/Frame 016079/0174 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 23, 2004
From: GENTNER, JEAN-LOUIS; ALEXANDRE, FRANCOIS; THEDREZ, BRUNO; GAUTHIER-LAFAYE, OLIVIER
To: AVANEX CORPORATION
Reel/Frame 015391/0266 →