IP Library Granted Patent US 7,138,335
Granted Patent B2
US 7,138,335 · App. 10/898,335 · Granted Nov 21, 2006

Method of forming electrode for flat display panel

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,138,335
App. No.
10/898,335
Granted
Nov 21, 2006
Kind
B2
Abstract

A reducing agent is discharged by an ink-jet method into a groove between partition walls of a glass substrate formed by sandblasting, that is, a desired region where an electrode is to be formed. After fixing the reducing agent to the glass substrate, the entire substrate is immersed into a plating solution so as to reduce and deposit a plating catalytic metal contained in the plating solution in the region where the reducing agent is fixed. By immersing the entire substrate into an electroless plating solution, a metal is deposited by electroless plating in the region where the plating catalytic metal is deposited. The variation in the shape of electrodes to be formed is reduced, and mass production and low cost are achieved.

Claims (14)

1. An electrode formation method for a flat display panel for forming a metal electrode between partition walls of a flat display panel substrate having a plurality of partition walls on a surface thereof, comprising the steps of:

discharging a reducing agent for reducing and depositing a plating catalytic metal between the partition walls of the substrate and fixing the reducing agent;

reducing and depositing the plating catalytic metal between the partition walls of the substrate where the reducing agent is fixed; and

depositing a metal between the partition walls of the substrate to form a metal electrode by immersing the substrate on which the plating catalytic metal is reduced and deposited into an electroless plating solution.

2. The electrode formation method for a flat display panel of claim 1 , wherein

the reducing and depositing step comprises the step of immersing the substrate on which the reducing agent is fixed into a plating solution containing the plating catalytic metal.

3. The electrode formation method for a flat display panel of claim 1 , wherein the reducing and depositing step comprises the step of discharging a plating solution containing the plating catalytic metal between the partition walls of the substrate where the reducing agent is fixed.

4. The electrode formation method for a flat display panel of claim 1 , further comprising the step of further depositing, on a surface of the metal deposited between the partition walls of the substrate, a metal of the same kind as or different kind from said metal by supplying a current to said metal deposited between the partition walls.

5. The electrode formation method for a flat display panel of claim 1 , wherein the partition walls are formed by cutting a surface of a glass substrate by sandblasting or etching.

6. An electrode formation method for a plasma display panel for forming a metal electrode between partition walls of a plasma display panel substrate having a plurality of partition walls on a surface thereof for partitioning a discharge space, comprising:

forming the partition walls by cutting a surface of a glass substrate by sandblasting;

discharging a reducing agent for reducing and depositing a plating catalytic metal between the partition walls of the glass substrate and fixing the reducing agent;

reducing and depositing the plating catalytic metal between the partition walls of the glass substrate by immersing the glass substrate where the reducing agent is fixed into a plating solution containing the plating catalytic metal; and

depositing a metal between the partition walls of the glass substrate to form a metal electrode by immersing the glass substrate on which the plating catalytic metal is reduced and deposited into an electroless plating solution.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2008
From: HITACHI LTD.
To: HITACHI PLASMA PATENT LICENSING CO., LTD.
Reel/Frame 021785/0512 →
TRUST AGREEMENT REGARDING PATENT RIGHTS, ETC. DATED JULY 27, 2005 AND MEMORANDUM OF UNDERSTANDING REGARDING TRUST DATED MARCH 28, 2007 Recorded Apr 13, 2007
From: HITACHI LTD.
To: HITACHI PLASMA PATENT LICENSING CO., LTD.
Reel/Frame 019147/0847 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2005
From: FUJITSU LIMITED
To: HITACHI, LTD.
Reel/Frame 017105/0910 →
CORRECTIVE COVERSHEET TO CORRECT THE NAME OF THE SECOND ASSIGNOR PREVIOUSLY RECORDED ON REEL 015614, FRAME 0513. Recorded Mar 8, 2005
From: TOYODA, OSAMU; FUKUTA, SHINYA
To: FUJITSU LIMITED
Reel/Frame 015855/0131 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2004
From: TOYODA, OSAMU; FURUTA, SHINYA
To: FUJITSU LIMITED
Reel/Frame 015614/0513 →