IP Library Granted Patent US 7,479,020
Granted Patent B2
US 7,479,020 · App. 10/994,696 · Granted Jan 20, 2009

Electronic control module having an internal electric ground

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Quick Facts
Patent No.
US 7,479,020
App. No.
10/994,696
Granted
Jan 20, 2009
Kind
B2
Abstract

An electronic control module for electrical components of a vehicle. The electronic control module has an internal electrical ground. The module comprises a housing having an open end and a side wall extending from the open end. The side wall has a slot formed along the side wall. The module further comprises a printed circuit board disposed within the slot. The printed circuit board has a solder pattern disposed thereon, wherein at least a portion of the solder pattern is adjacent the open end and aligned with the slot. The module further comprises an end plate attached to the open end of the housing to enclose the printed circuit board therein. The end plate has an aperture being aligned with the slot of the housing. The module further comprises an attachment member disposed through the aperture in the slot. The attachment member is in contact with the portion of the solder pattern and with the side wall to provide an electrical ground for the printed circuit board.

Claims (24)

1. An electronic control module for electrical components of a vehicle, the module comprising:

a housing having an open end and a side wall extending from the open end, the side wall having a slot formed along the side wall;

a printed circuit board disposed within the slot, the printed circuit board having a solder pattern disposed thereon, at least a portion of the solder pattern being adjacent the open end and received within the slot;

an end plate attached to the open end of the housing to enclose the printed circuit board therein, the end plate having an aperture being aligned with the slot of the housing; and

an attachment member disposed through the aperture and in the slot, the attachment member being in contact with the portion of the solder pattern and with the side wall to provide an electrical ground for the printed circuit board.

2. The module of claim 1 wherein the housing member further includes a closed end and the side wall is a first side wall having a first slot formed along the first side wall.

3. The module of claim 2 wherein the housing member further includes a second side wall having a second slot formed along the second side wall.

4. The module of claim 3 wherein the printed circuit board is disposed within the first and second slots.

5. The module of claim 4 wherein the portion of the solder pattern is adjacent the open end and aligned with one of the first and second slots.

6. The module of claim 3 wherein the aperture of the end plate is aligned with one of the first and second slots of the housing.

7. The module of claim 1 wherein the aperture is a plurality of apertures, each aperture being aligned with one of the first and second slots of the housing.

8. The module of claim 1 wherein the slot is a C-channel formed along the side wall.

9. The module of claim 1 wherein the printed circuit board is made of one of the following materials:

ceramic, polymeric, and polymer composite materials.

10. The module of claim 3 wherein the attachment member is in contact with one of the first and second side walls for providing a ground for the printed circuit board.

11. An electronic control module for electrical components of a vehicle, the module comprising:

a housing having an open end and a closed end, the housing further including first and second opposing side walls extending between the open and closed ends, the first side wall having a first slot formed along the first side wall and the second side wall having a second slot formed along the second side wall;

a printed circuit board disposed within the first and second slots, the printed circuit board having a solder pattern disposed thereon, at least a portion of the solder pattern being adjacent the open end and received within one of the first and second slots;

an end plate attached to the open end of the housing to enclose the printed circuit board therein, the end plate having apertures each being aligned with one of the first and second slots of the housing; and

an attachment member disposed through the aperture at one of the first and second slots, the attachment member being in contact with the portion of the solder pattern and with one of the first and second side walls for providing a ground for the printed circuit board.

12. The module of claim 11 wherein the aperture is a plurality of apertures, each aperture being aligned with one of the first and second slots of the housing.

13. The module of claim 11 wherein the slot is a C-channel formed along the side wall.

14. The module of claim 11 wherein the printed circuit board is made of one of the following materials:

ceramic, polymeric, and polymer composite materials.

Assignments (12)
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Jun 9, 2014
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 033107/0717 →
SECURITY INTEREST Recorded Apr 18, 2014
From: VISTEON CORPORATION, AS GRANTOR; VISTEON GLOBAL TECHNOLOGIES, INC., AS GRANTOR
To: CITIBANK., N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032713/0065 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS ON REEL 025241 FRAME 0317 Recorded Apr 26, 2011
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 026178/0412 →
SECURITY AGREEMENT Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025241/0317 →
SECURITY AGREEMENT (REVOLVER) Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025238/0298 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS RECORDED AT REEL 022575 FRAME 0186 Recorded Oct 7, 2010
From: WILMINGTON TRUST FSB, AS ADMINISTRATIVE AGENT
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 025105/0201 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS RECORDED AT REEL 022974 FRAME 0057 Recorded Oct 6, 2010
From: THE BANK OF NEW YORK MELLON
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 025095/0711 →
ASSIGNMENT OF PATENT SECURITY INTEREST Recorded Jul 17, 2009
From: JPMORGAN CHASE BANK, N.A., A NATIONAL BANKING ASSOCIATION
To: THE BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT
Reel/Frame 022974/0057 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Apr 21, 2009
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: WILMINGTON TRUST FSB, AS ADMINISTRATIVE AGENT
Reel/Frame 022575/0186 →
SECURITY INTEREST Recorded Feb 27, 2009
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK
Reel/Frame 022368/0001 →
SECURITY AGREEMENT Recorded Feb 7, 2008
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 020497/0733 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2004
From: WHITTON, DAVID M.
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 016027/0766 →