Optical integrated circuit package
View Patent ↗An optical device and method for making the same is disclosed. The device includes having a circuit element that is located in an opaque enclosure. The circuit element includes a die having an optical integrated circuit mounted on a carrier. The carrier includes a plurality of conductors connected to the optical integrated circuit. The opaque enclosure has a transparent window therein. The carrier is positioned in the enclosure such that light entering the enclosure through the window illuminates the die. The enclosure further includes an aperture through which the conductors protrude from the enclosure. The enclosure is at least partially filled with a layer of optically transparent material that passes light utilized or generated by said optical integrated circuit. The enclosure can be preformed to a higher degree of precision than that obtainable on conventional packaging fabrication lines.
1. An optical device comprising:
a circuit element comprising a die having an optical integrated circuit mounted on a carrier, said carrier comprising a plurality of conductors connected to said optical integrated circuit;
an opaque pre-molded plastic enclosure having a transparent window therein, said carrier being positioned in said enclosure such that said window is directly above said die and light entering said enclosure through said window illuminates said die, said enclosure further comprising an aperture through which said conductors protrude from said enclosure and an opaque medium in said aperture that prevents light from entering said enclosure except through said window; and
a layer of optically transparent material within said enclosure, said layer contacting said window and said die, said optically transparent material passing light of a wavelength utilized by, or generated by, said optical integrated circuit.
2. The optical device of claim 1 wherein said enclosure comprises a bottom section and a cover, said cover comprising said window.
3. The optical device of claim 2 wherein said cover further comprises said aperture.
4. The optical device of claim 1 wherein said window comprises a lens.
5. An optical device comprising:
a circuit element comprising a die having an optical integrated circuit mounted on a carrier, said carrier comprising a plurality of conductors connected to said optical integrated circuit;
an opaque enclosure having a transparent window therein, said carrier being positioned in said enclosure such that said window is directly above said die and light entering said enclosure through said window illuminates said die, said enclosure further comprising an aperture through which said conductors protrude from said enclosure and an opaque medium in said aperture that prevents light from entering said enclosure except through said window; and
a layer of optically transparent material within said enclosure, said layer contacting said window and said die, said optically transparent material passing light of a wavelength utilized by, or generated by, said optical integrated circuit, wherein said optical integrated circuit generates light of a first wavelength and wherein said optically transparent material includes a fluorescent material that converts a portion of said light to a second wavelength that is different from said first wavelength.
6. An optical device comprising:
a circuit element comprising a die having an optical integrated circuit mounted on a carrier, said carrier comprising a plurality of conductors connected to said optical integrated circuit;
an opaque enclosure having a transparent window therein, said carrier being positioned in said enclosure such that said window is directly above said die and light entering said enclosure through said window illuminates said die, said enclosure further comprising an aperture through which said conductors protrude from said enclosure and an opaque medium in said aperture that prevents light from entering said enclosure except through said window; and
a layer of optically transparent material within said enclosure, said layer contacting said window and said die, said optically transparent material passing light of a wavelength utilized by, or generated by, said optical integrated circuit, and an opaque material that prevents light from entering said enclosure through said aperture.
7. An optical device comprising:
a circuit element comprising a die having an optical integrated circuit mounted on a carrier, said carrier comprising a plurality of conductors connected to said optical integrated circuit;
an opaque enclosure having a transparent window therein, said carrier being positioned in said enclosure such that said window is directly above said die and light entering said enclosure through said window illuminates said die, said enclosure further comprising an aperture through which said conductors protrude from said enclosure and an opaque medium in said aperture that prevents light from entering said enclosure except through said window; and
a layer of optically transparent material within said enclosure, said layer contacting said window and said die, said optically transparent material passing light of a wavelength utilized by, or generated by, said optical integrated circuit, wherein said enclosure comprises a pre-molded plastic enclosure and said window comprises a plastic having a different melting temperature than said enclosure.
8. An optical device comprising:
a circuit element comprising a die having an optical integrated circuit mounted on a carrier, said carrier comprising a plurality of conductors connected to said optical integrated circuit;
an opaque enclosure having a transparent window therein, said carrier being positioned in said enclosure such that said window is directly above said die and light entering said enclosure through said window illuminates said die, said enclosure further comprising an aperture through which said conductors protrude from said enclosure and an opaque medium in said aperture that prevents light from entering said enclosure except through said window; and
a layer of optically transparent material within said enclosure, said layer contacting said window and said die, said optically transparent material passing light of a wavelength utilized by, or generated by, said optical integrated circuit, wherein said optical integrated circuit comprises an optical imaging array.
9. A method for fabricating an optical device comprising:
mounting a die comprising an optical integrated circuit on a carrier having a plurality of conductors connected to said optical integrated circuit;
placing said carrier into an opaque enclosure having a transparent window therein, said carrier being positioned in said enclosure such that light entering said enclosure through said window illuminates said die and said plurality of conductors protrudes from said opaque enclosure through an aperture in said opaque enclosure;
covering said die with a layer of optically clear material that contacts said window and said die; and
applying an opaque material that prevents light from entering said enclosure through said aperture such that light is prevented from entering said enclosure except through said window which is located above said die.
10. The method of claim 9 wherein said optically clear material comprises an epoxy that is placed in said enclosure in liquid form after said carrier has been placed in said enclosure and then cured to a solid form.
11. The method of claim 9 wherein said opaque enclosure comprises a bottom section and a top section and wherein said carrier is placed in said bottom section and then covered with said transparent material, followed by securing said top section to said bottom section.
12. The method of claim 9 wherein said enclosure comprises a pre-molded plastic enclosure.