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App. No. 11/149,539 · Confirmation No. 3357

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE THAT INCLUDES FORMING DUMMY PATTERNS IN AN ISOLATION REGION PRIOR TO FILLING WITH INSULATING MATERIAL

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Quick Facts
App. No.
11/149,539
Filed
2005-06-10
Granted
2006-07-11
Pub. No.
US20050237603A1
Art Unit
2813
PTA
-89 days