Decoupling capacitor density while maintaining control over ACLV regions on a semiconductor integrated circuit
View Patent ↗In one embodiment, a method of controlling the across-chip line-width variation (ACLV) on a semiconductor integrated circuit includes forming an ACLV controlled region including a plurality of semiconductor devices each having a gate structure and arranging the plurality of semiconductor devices to have a substantially uniform spacing between each gate structure. The method also includes forming a decoupling capacitor region adjacent to the ACLV controlled region. The decoupling capacitor region may include a plurality of capacitor structures each having a conductive structure, such as a polysilicon electrode, for example.
1. A semiconductor integrated circuit comprising:
an across-chip line-width variation (ACLV) controlled region including a plurality of semiconductor devices each having a gate structure and arranged to have a substantially uniform spacing between each gate structure; and
a decoupling capacitor region including a plurality of capacitor structures each having a conductive structure, wherein the decoupling capacitor region is adjacent to the ACLV controlled region;
wherein the plurality of capacitor structures is arranged such that a density of a material used to form the conductive structures increases as the distance from the ACLV controlled region increases.
2. The semiconductor integrated circuit as recited in claim 1 , wherein the plurality of capacitor structures is formed such that the density of the material used to form the conductive structures is within a predetermined density range within a first distance away from the ACLV controlled region.
3. The semiconductor integrated circuit as recited in claim 1 , wherein the decoupling capacitor region is formed such that the density of the material used to form the conductive structures is sufficient to allow each gate structure in the ACLV controlled region to be processed to have substantially uniform gate widths.
4. The semiconductor integrated circuit as recited in claim 1 , wherein each gate structure is formed from polycrystalline (poly) silicon.
5. The semiconductor integrated circuit as recited in claim 1 , wherein each conductive structure is formed from polycrystalline (poly) silicon.
6. The semiconductor integrated circuit as recited in claim 1 , wherein the decoupling capacitor region is arranged by placing each of the plurality of capacitor structures such that capacitor structures having conductive structures with a low poly density are nearest the ACLV controlled region and capacitor structures having conductive structures with a higher poly density are furthest from the ACLV controlled region.
7. A processor comprising:
one or more across-chip line-width variation (ACLV) controlled regions, each including a plurality of semiconductor devices each having a gate structure and arranged to have a substantially uniform spacing between each gate structure; and
one or more decoupling capacitor regions, each including a plurality of capacitor structures each having a conductive structure, wherein the decoupling capacitor region is adjacent to the one or more ACLV controlled regions;
wherein the plurality of capacitor structures is arranged such that a density of a material used to form the conductive structures increases as the distance from any of the one or more ACLV controlled region increases.