Method for attaching an optical filter to an encapsulated package
A method for attaching an optical device to an encapsulated electronic package. The method may include aligning and attaching an optical device to a non-singulated encapsulated electronic package using an adhesive, and curing the entire package. The method may further include singulating the non-singulated encapsulated electronic package with the optical device attached after curing.
1 . A method for attaching an optical device to a single component having a plurality of encapsulated electronic packages, the method comprising:
applying an adhesive to the single component;
aligning the optical device relative to the single component;
attaching the optical device to the single component using the adhesive;
curing the single component with the attached optical device; and
singulating the single component into a plurality of separate encapsulated packages, each with a portion of the optical device attached.
2 . The method of claim 1 , wherein the optical device attached to the single component is an optical filter.
3 . The method of claim 2 , wherein the optical filter attached to the single component is an interference filter with a plurality of substrates configured to produce a predetermined resolution patterning.
4 . The method of claim 2 , wherein singulating the single component further includes sawing the single component.
5 . The method of claim 2 , wherein singulating the single component further includes
partially sawing the single component and
breaking the partially-sawed single component into the plurality of separate encapsulated packages
6 . The method of claim 2 , wherein singulating the single component further includes dry process dicing the single component into the plurality of separate encapsulated packages.
7 . The method of claim 1 , wherein the adhesive applied to the single component is an epoxy resin.
8 . The method of claim 1 , wherein the adhesive applied to the single component is an ultraviolet (“UV”) curable composition.
9 . The method of claim 8 , wherein the curing includes applying an UV light to the single component with the attached optical device.
10 . A method for attaching optical devices to a single component having a plurality of encapsulated electronic packages, the method comprising:
singulating an unsingulated optical device having multiple optical devices into a plurality of separated optical devices;
applying an adhesive to the single component;
aligning each of the plurality of separated optical devices relative to the single component;
attaching each of the plurality of separated optical devices to the single component using the adhesive;
curing the single component with the attached plurality of separated optical devices; and
singulating the single component with the attached plurality of separated optical devices into a plurality of separate encapsulated packages, with each separate encapsulated package having a separated optical device attached after the singulation.
11 . The method of claim 10 , wherein aligning further includes positioning the plurality of separated optical devices on the single component so as to optimize the singulation of the single component.
12 . The method of claim 11 , wherein the unsingulated optical device is an optical filter.
13 . The method, of claim 12 , wherein the optical filter is an interference filter with a plurality of substrates configured to produce a predetermined resolution patterning.
14 . The method of claim 11 , wherein singulating the single component further includes sawing the single component with the plurality of separated optical devices attached.
15 . The method of claim 11 , wherein singulating the single component further includes
partially sawing the single component and
breaking the partially-sawed single component with the plurality of separated optical devices attached.
16 . The method of claim 11 , wherein singulating the single component further includes dry process dicing the single component with the plurality of separated optical devices attached.
17 . The method of claim 11 , wherein the adhesive applied to the single component is an epoxy resin.
18 . The method of claim 11 , wherein the adhesive applied to the single component is an UV curable composition.
19 . The method of claim 18 , wherein the curing further includes applying an UV light to the single component with the attached optical device.
20 . The method of claim 11 , further including marking each separate encapsulated package.