Mandrel with controlled release layer for multi-layer electroformed ink-jet orifice plates
View Patent ↗A system and method are provided for fabricating an orifice plate for use in an ink jet printing system. Initially, a substrate base is provided, and a controlled-release layer is applied to a surface of the substrate base. A conductive metal layer is adherently coated on the controlled-release layer. At least one dielectric peg is created on a portion of the conductive metal layer, and a nozzle layer is applied on the conductive metal layer to partially cover the dielectric peg. A trench is formed that covers a nozzles prior to formation of a reinforcing layer. The controlled-release layer is removed to separate the orifice plate from the substrate base. The conductive metal layer is selectively etched from the nozzle layer to complete fabricating the orifice plate.
1. A method of fabricating an orifice plate for use in an ink jet printing system, comprising the steps of:
providing a substrate base;
applying a controlled-release layer to a surface of the substrate base;
adherently coating a conductive metal layer on the controlled-release layer;
creating at least one dielectric peg on a portion of the conductive metal layer;
applying a nozzle layer on the conductive metal layer wherein the nozzle layer partially covers the at least one dielectric peg;
forming a trench that covers a nozzle prior to formation of a reinforcing layer;
removing the controlled-release layer to separate the orifice plate from the substrate base;
selectively etching the conductive metal layer from the nozzle layer to complete fabricating the orifice plate.
2. A method as claimed in claim 1 wherein the substrate base comprises a metal substrate not attacked by chemicals used in electroforming processes.
3. A method as claimed in claim 1 wherein the substrate base comprises a chrome coated glass substrate.
4. A method as claimed in claim 1 wherein the controlled-release layer comprises an organic chemical layer.
5. A method as claimed in claim 4 wherein the organic chemical layer comprises a photoresist.
6. A method as claimed in claim 1 wherein the conductive metal layer comprises a copper layer.
7. A method as claimed in claim 1 wherein the conductive metal layer comprises a conductive layer having an approximate thickness of 0.1 micron.
8. A method as claimed in claim 1 wherein the step of adherently coating comprises the step of sputtering.
9. A method as claimed in claim 1 wherein the controlled-release layer comprises a controlled-release layer having an approximate thickness of 0.5 micron.
10. A method as claimed in claim 1 wherein the controlled-release layer comprises a controlled-release layer applied to the substrate base by spin coating.