Communications connectors with parasitic and/or inductive coupling elements for reducing crosstalk and related methods
Communications connectors that include parasitic conductive loops are provided, such as a wire connection system that includes a first pair of wire connection terminals mounted in a mounting substrate, a second pair of wire connection terminals mounted in a mounting substrate and a parasitic conductive loop mounted adjacent at least the first pair of wire connection terminals.
1. A wire connection system, comprising:
a mounting substrate;
a first pair of wire connection terminals mounted in the mounting substrate;
a second pair of wire connection terminals mounted in the mounting substrate; and
a parasitic conductive loop mounted adjacent at least a first wire connection terminal of the first pair of wire connection terminals.
2. The wire connection system of claim 1 , wherein a first portion of the parasitic conductive loop is positioned to receive an induced signal from at least the first wire connection terminal of the first pair of wire connection terminals, and wherein a second portion of the parasitic conductive loop is positioned so that the received induced signal generates a magnetic field adjacent at least one of the wire connection terminals of the second pair of wire connection terminals.
3. The wire connection system of claim 1 , wherein the parasitic conductive loop is mounted between the first pair and the second pair of wire connection terminals.
4. The wire connection system of claim 1 , wherein the wire connection terminals comprise insulation displacement contacts (IDCs).
5. The wire connection system of claim 4 , wherein each of the IDCs includes slots for receiving conductors at opposite upper and lower ends thereof, the IDCs being mounted in the mounting substrate in at least two rows, wherein the slots of each IDC are generally parallel and non-collinear.
6. The wire connection system of claim 1 , wherein the parasitic conductive loop is configured to receive a first induced signal from the first wire connection terminal of the first pair of wire connection terminals that travels around the loop in a first direction, and to receive a second induced signal from a second wire connection terminal of the first pair of wire connection terminals that travels around the loop in the first direction.
7. The wire connection system of claim 1 , wherein the first pair of wire connection terminals comprises a first insulation displacement contact (IDC) and a second IDC, wherein the second pair of wire connection terminals comprises a third IDC and a fourth IDC, wherein the first and third IDCs are part of a first row of IDCs and the second and fourth IDCs are part of a second row of IDCs, and wherein the parasitic conductive loop is configured to couple energy from a signal carried on the first IDC to the fourth IDC.
8. The wire connection system of claim 7 , wherein the parasitic conductive loop is further configured to couple energy from a signal carried on the second IDC to the third IDC.
9. The wire connection system of claim 1 , wherein the wire connection system comprises a 110-style wire connection block.
10. The wire connection system of claim 1 , wherein a first portion of the parasitic conductive loop is sized, shaped and positioned with respect to the first wire connection terminal of the first pair of wire connection terminals in order to induce a first crosstalk signal on the parasitic conductive loop from a signal carried by the first wire connection terminal, and wherein a second portion of the parasitic conductive loop is sized, shaped and positioned with respect to one of the wire connection terminals of the second pair of wire connection terminals in order to induce a second crosstalk signal onto the one of the wire connection terminals of the second pair of wire connection terminals from the first crosstalk signal.
11. The wire connection system of claim 1 , wherein the parasitic conductive loop is configured to receive a first induced signal from at least the first wire connection terminal of the first pair of wire connection terminals and to induce a compensating crosstalk signal on both wire connection terminals of the second pair of wire connection terminals.
12. The wire connection system of claim 1 , wherein the first pair of wire connection terminals are part of a first connecting block, and wherein the second pair of wire connection terminals are part of a second wire connection block.
13. The wire connection system of claim 1 , wherein the first and second pairs of wire connection terminals comprise adjacent pairs of wire connection terminals in a first connecting block.
14. The wire connection system of claim 2 , wherein the magnetic field at least partially cancels a second magnetic field generated by a second wire connection terminal of the first pair of wire connection terminals.
15. A crosstalk reduction circuit for a communications connector that includes a first conductor that carries a first signal and a second conductor that carries a second signal, the crosstalk reduction circuit comprising:
a parasitic conductive loop that is configured to receive a current induced from a first magnetic field generated by the first signal, wherein the current induced on the parasitic conductive loop generates a third magnetic field that at least partially cancels out a second magnetic field that is generated by the second signal.
16. The crosstalk reduction circuit of claim 15 , wherein the first and second signals comprise equal but opposite signals.
17. The crosstalk reduction circuit of claim 15 , wherein a first portion of the parasitic conductive loop is adjacent the first conductor and wherein a second portion of the parasitic conductive loop is adjacent the second conductor, and wherein a portion of a third magnetic field adjacent the first portion of the parasitic conductive loop has a first direction and a portion of the third magnetic field adjacent the second portion of the parasitic conductive loop has a second direction that is substantially opposite the first direction.
18. The crosstalk reduction circuit of claim 15 , wherein the first conductor comprises a first conductor of a pair of conductors of a modular plug, and wherein the second conductor comprises the second conductor of the pair of conductors, and wherein the first and second signals comprise equal magnitude but opposite polarity signals.
19. The crosstalk reduction circuit of claim 18 , wherein the modular plug includes first, second, third, fourth, fifth, sixth, seventh and eighth contacts that are in an adjacent and side-by-side relationship in a contact area of the modular plug, wherein the fourth and fifth contacts comprise a first contact pair for carrying a first differential signal, the first and second contacts comprise a second contact pair for carrying a second differential signal, the third and sixth contacts comprise a third contact pair for carrying a third differential signal, the seventh and eighth contacts comprise a fourth contact pair for carrying a fourth differential signal, and wherein the first conductor is electrically connected to one of the contacts of the third contact pair and wherein the second conductor is electrically connected to the other contact of the third contact pair.
20. The crosstalk reduction circuit of claim 15 , wherein the first conductor comprises a first insulation displacement contact (IDC) and wherein the second conductor comprises a second IDC.
21. The crosstalk reduction circuit of claim 20 , wherein the first IDC has a first conductor receiving slot and a second conductor receiving slot, wherein the first and second conductor receiving slots are arranged to be in the same plane but non-collinear.
22. The crosstalk reduction circuit of claim 15 , wherein the third magnetic field at least partially cancels the second magnetic field in the vicinity of a third conductor of the communications connector.
23. A communications connector, comprising:
a conductive parasitic coupling element;
a first conductor adjacent a first portion of the conductive parasitic coupling element; and
a second conductor adjacent a second portion of the conductive parasitic coupling element;
wherein the conductive parasitic coupling element is configured to receive a signal that is induced from a first signal that is transmitted on the first conductor, transmit the received signal over at least a portion of the conductive parasitic element, and then couple the received signal to the second conductor, wherein the coupled signal is induced on the second conductor in a direction opposite the direction of the first signal.
24. The communications connector of claim 23 , wherein the conductive parasitic coupling element comprises a loop, and wherein the first portion of the parasitic coupling element is on a first part of the loop and the second portion of the parasitic coupling element is on a second portion of the loop that is generally opposite the first part of the loop.
25. The communications connector of claim 23 , wherein the first and second conductors each comprise an insulation displacement contact (IDC) that has an upper end having a first slot and a lower end having a second slot that is parallel and non-collinear with respect to the first slot.
26. A communications connector, comprising:
a first pair of contacts comprising a First contact and a second contact that are configured to receive a first differential signal;
a second pair of contacts comprising a third contact and a fourth contact that are configured to receive a second differential signal; and
a conductive parasitic coupling element positioned between the first pair of contacts and the second pair of contacts, wherein the conductive parasitic coupling element is configured to receive a first induced signal from the first contact that has a first polarity and is configured to receive a second induced signal from the second contact that has the first polarity.
27. The communications connector of claim 26 , wherein the conductive parasitic coupling element comprises a parasitic conductive loop.
28. The communications connector of claim 27 , wherein the parasitic conductive loop is configured to induce a third signal on the third contact from the first and second induced signals.
29. A method for reducing a differential crosstalk signal induced from a first pair of conductors that comprises a first conductor and a second conductor onto a third conductor of a communications connector, the method comprising:
inducing a crosstalk signal from a signal flowing through the first conductor onto a first portion of a parasitic conductive loop so as to generate a first magnetic field around a second portion of the parasitic conductive loop that at least partially cancels a second magnetic field generated by a signal flowing through the second conductor.
30. The method of claim 29 , wherein the first and second magnetic fields at least partially cancel each other adjacent the third conductor.
31. A wire connection block, comprising:
a first wire connection terminal and a second wire connection terminal that define a first row of wire connection terminals;
a third wire connection terminal and a fourth wire connection terminal that define a second row of wire connection terminals that is generally parallel to the first row of wire connection terminals;
wherein each of the first through fourth wire connection terminals has an upper end having a first slot and a lower end having a second slot that is parallel and non-collinear with respect to the first slot; and
an inductive coupling element positioned to inductively couple energy from a signal transmitted on the first wire connection terminal to the fourth wire connection terminal.
32. The wire connection block of claim 31 , wherein the inductive coupling element comprises a parasitic conductive loop.
33. The wire connection block of claim 31 , wherein the inductive coupling element comprises a signal carrying protrusion on the first wire connection terminal.
34. The wire connection system of claim 1 , wherein the mounting substrate is comprised of a first mounting substrate and a second mounting substrate, wherein the first pair of wire connection terminals are mounted in the first mounting substrate, and wherein the second pair of wire connection terminals are mounted in the second mounting substrate.