Solder seals within a switching system
View Patent ↗A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.
1. A method for attaching a silicon chip to a planar light circuit comprising the following steps:
(a) forming recessed areas in the planar light circuit; the planar light circuit including optical waveguide having a cladding
(b) forming a solder ring within the recessed areas of the planar light circuit; and,
(c) soldering the silicon chip to the planar light circuit using solder in the solder ring; wherein the solder ring directly bonds the cladding of the optical waveguide to the silicon chip.
2. A method as in claim 1 wherein step (b) includes:
forming a metal ring under the solder ring.
3. A method as in claim 1 wherein step (c) includes:
heating solder with a heating region located on the silicon chip.
4. A method as in claim 1 wherein step (c) includes:
heating the solder with a heating region located on the silicon chip, the heating region being composed of one of the following:
a diffusion well;
a metal resistor.