Mechanical Housing
An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.
1 . An apparatus for containing and cooling objects comprising:
a cage of generally non-thermally conductive material comprising:
at least one first aperture;
at least one second aperture exposing at least a portion of a case and different than the first aperture;
wherein the case is of thermally conductive material, is partially within the cage, and is accessible to objects through the at least one first aperture;
at least one heat sink thermally coupled to the case through the at least one second aperture; and
at least one cover for sealing the at least one first aperture;
wherein one or more of the objects thermally coupled to the case will transfer heat to the case, through the second aperture, to the heat sink;
wherein the at least one heat sink protrudes though the at least one second aperture to thermally couple to the case.
2 . The apparatus of claim 1 wherein the at least one case protrudes though the at least one second aperture to thermally couple to the at least one heat sink.
3 . The apparatus of claim 1 further comprising a conductive thermal path between the at least one case and the at least one heat sink.
4 . The apparatus of claim 1 wherein the cage is made of a generally non-thermally conductive material from the following group: nylon, plastic, ABS, and structural foam.
5 . The apparatus of claim 1 further comprising a base.
6 . The apparatus of claim 1 wherein the at least one heat sink includes fins.
7 . The apparatus of claim 1 wherein the at least one case comprises one of the following thermally conductive materials: aluminum, copper, bronze, or combinations thereof.
8 . The apparatus of claim 1 wherein the at least one heat sink comprises one of the following thermally conductive materials: aluminum, copper, bronze, or combinations thereof.
9 . An apparatus for containing and cooling objects comprising:
a cage of generally non-thermally conductive material comprising:
at least one first aperture;
at least one second aperture exposing at least a portion of a case and different than the first aperture;
wherein the case is of thermally conductive material, is partially within the cage, and is accessible to objects through the at least one first aperture;
at least one heat sink thermally coupled to the case through the at least one second aperture; and
at least one cover for sealing the at least one first aperture;
wherein one or more of the objects thermally coupled to the case will transfer heat to the case, through the second aperture, to the heat sink;
wherein the at least one case protrudes though the at least one second aperture to thermally couple to the at least one heat sink.
10 . The apparatus of claim 9 further comprising a conductive thermal path between the at least one case and the at least one heat sink.
11 . The apparatus of claim 1 wherein the cage is made of a generally non-thermally conductive material from the following group: nylon, plastic, ABS, and structural foam.
12 . The apparatus of claim 1 further comprising a base.
13 . The apparatus of claim 1 wherein the at least one heat sink includes fins.
14 . The apparatus of claim 1 wherein the at least one case comprises one of the following thermally conductive materials: aluminum, copper, bronze, or combinations thereof.