Integrated circuit for a high-side transistor driver
View Patent ↗The high voltage integrated circuit is disclosed. The high voltage integrated circuit comprises a low voltage control circuit, a floating circuit, a P substrate, a deep N well disposed in the substrate and a plurality of P wells disposed in the P substrate. The P wells and deep N well serve as the isolation structures. The low voltage control circuit is located outside the deep N well and the floating circuit is located inside the deep N well. The deep N well forms a high voltage junction barrier for isolating the control circuit from the floating circuit.
1. A high voltage integrated circuit comprising:
a P substrate;
a deep N well, disposed in the P substrate, wherein a wall of the deep N well forms a high voltage junction barrier, wherein the deep N well extends from an upper-most surface of the P substrate;
a control circuit, located an outside of the deep N well;
a MOS circuit, located an inside of the deep N well, wherein the MOS circuit is within the deep N well with separation from other circuit;
an insulating layer over the deep N well, extending from the inside of the deep N well to the outside of the deep N well;
a first metal layer, disposed on the insulating layer over the high voltage junction barrier of the deep N well;
a dielectric layer on the first metal layer with an end portion contacting on the insulating layer to fully insulate the first metal layer; and
a second metal layer, disposed above and on the dielectric layer with an end portion on the insulating layer, so that the first metal layer and the dielectric layer are enclosed within the second metal layer;
wherein the first metal layer, the second metal layer and the dielectric layer form a capacitor located above a periphery region of the deep N well without direct connection to the deep N well for feeding a control signal of the control circuit to the floating circuit, and wherein the deep N well forms the high voltage junction barrier isolating the control circuit from the floating circuit, wherein the floating circuit is within the deep N well without direct connection to the capacitor.
2. The high voltage integrated circuit of claim 1 , further comprising a plurality of first P diffusion regions disposed in the P substrate, and wherein the first P diffusion regions and the deep N well serve as isolation structures.
3. The high voltage integrated circuit of claim 1 , wherein the floating circuit includes at least one N type MOSFET device comprising:
a first P well, disposed in the deep N well;
a first N diffusion region, located in the first P well;
a first drain region, disposed in the first N diffusion region;
a first source region, disposed in the first P well wherein a conduction channel is formed between the first source region and the first drain region; and
a first contact region, disposed in the first P well.
4. The high voltage integrated circuit of claim 1 , wherein the floating circuit includes at least a MOSFET device comprising:
a P well, disposed in the deep N well;
a drain region, disposed in the P well;
a source region, disposed in the deep N well, wherein a conduction channel is formed between the source region and the drain region; and
a contact region, disposed in the deep N well.
5. The high voltage integrated circuit of claim 1 , wherein the control circuit includes at least a MOSFET device comprising:
a first N well, disposed in the P substrate;
a P diffusion region, located in the first N well;
a drain region, disposed in the first N well;
a source region, disposed in the P diffusion region, wherein a conduction channel is formed between the source region and the drain region; and
a contact region, disposed in the P diffusion region, wherein the P diffusion region encloses the source region and the contact region.
6. An integrated circuit comprising:
a P substrate;
a deep N well, disposed in the P substrate, wherein a wall of the deep N well forms a high voltage junction barrier, wherein the deep N well extends from an upper-most surface of the P substrate;
a control circuit, located an outside of the deep N well;
an insulating layer on the deep N well, extending from the inside of the deep N well to the outside of the deep N well;
a capacitor disposed on the insulating layer at a periphery of the deep N well without directly connecting to the deep N well, wherein the capacitor comprises:
a first metal layer, disposed on the insulating layer over the high voltage junction barrier of the deep N well;
a dielectric layer on the first metal layer with an end portion contacting on the insulating layer to fully insulate the first metal layer; and
a second metal layer, disposed above and on the dielectric layer with an end portion on the insulating layer, so that the first metal layer and the dielectric layer are enclosed within the second metal layer; and
the MOS circuit, located at an inside of the deep N well, wherein the MOS circuit is within the deep N well with separation from other circuit, wherein the high voltage junction barrier of the deep N well is at a high voltage level isolating the control circuit from the MOS circuit.
7. The integrated circuit of claim 6 , further comprising a plurality of first P diffusion regions disposed in the P substrate, wherein the first P diffusion regions and the deep N well serve as isolation structures.
8. The integrated circuit of claim 6 , wherein the capacitor comprises:
the first metal layer and the second metal layer form a capacitor for feeding the control signal of the control circuit to the floating MOS circuit.
9. The integrated circuit of claim 6 , wherein the MOS circuit includes at least one N type MOSFET device comprising:
a first P well, disposed in the deep N well;
a first N diffusion region, located in the first P well;
a first drain region, disposed in the first N diffusion region;
a first source region, wherein a conduction channel is formed between the first source region and the first drain region; and
a first contact region, disposed in the first P well.
10. The integrated circuit of claim 6 , wherein the MOS circuit includes at least a MOSFET device comprising:
a P well, disposed in the deep N well;
a drain region, disposed in the P well;
a source region, wherein a conduction channel is formed between the source region and the drain region; and
a contact region, disposed in the deep N well.
11. The integrated circuit of claim 6 , wherein the control circuit includes at least a MOSFET device comprising:
a first N well, disposed in the P substrate;
a P diffusion region, located in the first N well;
a drain region, disposed in the first N well;
a source region, disposed in the P diffusion region, wherein a conduction channel is formed between the source region and the drain region; and
a contact region, disposed in the P diffusion region, wherein the P diffusion region encloses the source region and the contact region.
12. The high voltage integrated circuit of claim 1 , further comprising a third metal layer, disposed over the dielectric layer and the insulating layer at the outside of the deep N well.
13. A high voltage integrated circuit comprising:
a P substrate;
a deep N well, disposed in the P substrate, wherein a wall of the deep N well forms a high voltage junction barrier;
a control circuit, located an outside of the deep N well;
a MOS circuit, located an inside of the deep N well, wherein the MOS circuit is within the deep N well with separation from other circuit;
an insulating layer on over the deep N well, extending from the inside of the deep N well to the outside of the deep N well;
a first metal layer, disposed on the insulating layer over the high voltage junction barrier of the deep N well;
a dielectric layer on the first metal layer with an end portion contacting on the insulating layer to fully insulate the first metal layer; and
a second metal layer, disposed above and on the dielectric layer with an end portion on the insulating layer, so that the first metal layer and the dielectric layer are enclosed within the second metal layer;
wherein the first metal layer, the second metal layer and the dielectric layer form a capacitor located above an entire periphery region of the deep N well without direct connection to the deep N well for feeding a control signal of the control circuit to the MOS circuit, and wherein the deep N well forms the high voltage junction barrier isolating the control circuit from the MOS circuit, wherein the MOS circuit is within the deep N well without direct connection to the capacitor.
14. An integrated circuit comprising:
a P substrate;
a deep N well, disposed in the P substrate, wherein a wall of the deep N well forms a high voltage junction barrier;
a control circuit, located an outside of the deep N well;
an insulating layer on the deep N well, extending from the inside of the deep N well to the outside of the deep N well;
a capacitor disposed on the insulating layer at an entire periphery and an inside of the deep N well without directly connecting to the deep N well for feeding a control signal of the control circuit to a MOS circuit, wherein the capacitor comprises:
a first metal layer, disposed on the insulating layer over the high voltage junction barrier of the deep N well;
a dielectric layer on the first metal layer with an end portion contacting on the insulating layer to fully insulate the first metal layer; and
a second metal layer, disposed above and on the dielectric layer with an end portion on the insulating layer, so that the first metal layer and the dielectric layer are enclosed within the second metal layer; and
the MOS circuit, located at an inside of the deep N well, wherein, wherein the MOS circuit is isolated by the deep N well without physical interconnection structure to interconnect to other circuit, the high voltage junction barrier of the deep N well is at a high voltage level isolating the control circuit from the MOS circuit.