Integrated circuit assembly including RFID and components thereof
An integrated circuit (IC) assembly includes circuitry, radio frequency identification (RFID) tag circuitry, and an antenna structure. The circuitry is operable to perform at least one function. The RFID tag circuitry is coupled to process an RFID signal to produce a supply voltage for the RFID tag circuitry and to produce a response RFID signal. The response RFID signal includes information regarding at least one of: a device including the IC assembly, the IC assembly, and the at least one function. The antenna structure is coupled to receive the RFID signal and to provide the RFID signal to the RFID tag circuitry and to transmit the response RFID signal.
1 . An integrated circuit (IC) assembly comprises:
circuitry operable to perform at least one function;
radio frequency identification (RFID) tag circuitry coupled to process an RFID signal to produce a supply voltage for the RFID tag circuitry and, when requested, to produce a response RFID signal, wherein the response RFID signal includes information regarding at least one of: a device including the IC assembly, the IC assembly, and the at least one function; and
an antenna structure coupled to receive the RFID signal and to provide the RFID signal to the RFID tag circuitry and to transmit the response RFID signal.
2 . The IC assembly of claim 1 further comprises:
the circuitry being on a die; and
the RFID tag circuitry being on the die.
3 . The IC assembly of claim 2 , wherein the circuitry comprises at least one of:
a transmitter for transmitting outbound data;
a receiver for receiving inbound data;
a processing module;
memory;
a digital circuit; and
an analog circuit.
4 . The IC assembly of claim 3 , wherein the transmitter comprises:
a baseband processing module coupled to convert outbound data into outbound signals in accordance with at least one wireless communication protocol; and
an RF transmission section coupled to convert the outbound signals into outbound RFID signals, wherein the RF transmission section is coupled to the antenna assembly, and wherein the baseband processing module interprets a baseband representation of the RFID signal, generates a response thereto, and provides the response to the RFID tag circuitry, wherein the RFID tag circuitry converts the response into the response RFID signal.
5 . The IC assembly of claim 2 further comprises:
a package substrate that supports the die and the antenna structure.
6 . The IC assembly of claim 1 further comprises:
the circuitry being on a first die;
the RFID tag circuitry being on second die; and
a package that encases the first and second dies.
7 . The IC assembly of claim 6 further comprises:
a package substrate within the package, wherein the package substrate supports the antenna structure and the first and second dies.
8 . The IC assembly of claim 1 further comprises:
the circuitry coupled to perform at least one of a plurality of low power functions; and
the RFID tag circuitry coupled to provide the supply voltage to the circuitry when the circuitry is in a power saving mode.
9 . The IC assembly of claim 1 , wherein the antenna structure comprises at least one of:
an RFID antenna;
a diversity antenna system;
a first antenna for the RFID tag circuitry and a second antenna for the circuitry; and
third and fourth antennas for the RFID tag circuitry, wherein the third antenna has a first polarization and the fourth antenna has a second polarization.
10 . An integrated circuit (IC) assembly comprises:
radio frequency (RF) power recovery circuit coupled to produce a supply voltage from an RF signal;
an antenna structure coupled to receive the RF signal and to provide the RF signal to the RF power recovery circuit; and
circuitry coupled to receive the supply voltage when the circuitry is in a power savings mode, wherein the circuitry perform at least one of a plurality of low power functions.
11 . The IC assembly of claim 10 further comprises:
the circuitry being on a die; and
the RF power recovery circuit being on the die.
12 . The IC assembly of claim 11 further comprises:
a package substrate that supports the die and the antenna structure.
13 . The IC assembly of claim 10 further comprises:
the circuitry being on a first die;
the RF power recovery circuit being on second die; and
a package that encases the first and second dies.
14 . The IC assembly of claim 13 further comprises:
a package substrate within the package, wherein the package substrate supports the antenna structure and the first and second dies.
15 . The IC assembly of claim 10 , wherein the antenna structure comprises at least one of:
an RF antenna;
a diversity antenna system;
a first antenna for the RF power recovery circuitry and a second antenna for the circuitry; and
third and fourth antennas for the RF power recovery circuit, wherein the third antenna has a first polarization and the fourth antenna has a second polarization.
16 . The IC assembly of claim 10 further comprises:
the circuitry including a wireless transceiver, wherein the plurality of low power functions includes at least two of standby mode, channel monitoring, a query response, and short messaging services.
17 . The IC assembly of claim 10 further comprises:
a battery charger coupled to an external battery, wherein, when the circuitry is in a power savings mode, the battery charger converts the supply voltage into a charge current for charging the external battery.
18 . An integrated circuit (IC) die comprises:
circuitry operable to perform at least one function; and
radio frequency identification (RFID) tag circuitry coupled to process an RFID signal to produce a supply voltage for the RFID tag circuitry and, when requested, to produce a response RFID signal, wherein the response RFID signal includes information regarding at least one of: an IC assembly that includes the IC die, a device that includes the IC assembly, and the at least one function.
19 . The IC die of claim 18 , wherein the circuitry comprises at least one of:
a transmitter for transmitting outbound data;
a receiver for receiving inbound data;
a processing module;
memory;
a digital circuit; and
an analog circuit.
20 . The IC die of claim 19 , wherein the transmitter comprises:
a baseband processing module coupled to convert outbound data into outbound signals in accordance with at least one wireless communication protocol; and
an RF transmission section coupled to convert the outbound signals into outbound RFID signals, wherein the RF transmission section is coupled to the antenna assembly, and wherein the baseband processing module interprets the RFID signal, generates a response thereto, and provides the response to the RFID tag circuitry, wherein the RFID tag circuitry converts the response into the response RFID signal.
21 . The IC die of claim 18 further comprises:
the circuitry coupled to perform at least one of a plurality of low power functions; and
the RFID tag circuitry coupled to provide the supply voltage to the circuitry when the circuitry is in a power saving mode.
22 . The IC die of claim 18 further comprises:
an antenna structure coupled to the RFID tag circuitry.