Semiconductor device and method for fabricating the same
A semiconductor device of a dual-gate structure including a P-channel type field-effect transistor formed at a first region of a substrate and an N-channel type field-effect transistor formed at a second region of the substrate, includes a gate electrode including a polycrystalline silicon film continuously formed on the substrate to cover the first and second regions and a metal silicide film formed on the polycrystalline silicon film. The polycrystalline silicon film has a P-type part located on the first region and an N-type part coming into contact with the P-type part and located on the second region, and the P-type part is further doped with a heavier element than a P-type impurity that determines a conductivity type of the P-type part.
1. A semiconductor device of a dual-gate structure comprising: a P-channel type field-effect transistor formed at a first region of a substrate and an N-channel type field-effect transistor formed at a second region of the substrate, said device comprising:
a gate electrode including a polycrystalline silicon film continuously formed on the substrate to cover the first and second regions and a metal silicide film formed on the polycrystalline silicon film,
wherein the polycrystalline silicon film has a P-type part located on the first region and an N-type part coming into contact with the P-type part and located on the second region,
the P-type part is thicker than the N-type part,
an end part of the P-type part located above the N-type part and at the interface between the P-type part and the N-type part of the polycrystalline silicon film is normally tapered, and
a taper angle of the normally tapered end part is 40 through 60 degrees both inclusive.
2. The semiconductor device of claim 1 , wherein the difference in thickness between the P-type part and the N-type part is equal to or smaller than twice the thickness of the metal silicide film.
3. The semiconductor device of claim 1 , wherein the top surface of part of the polycrystalline silicon film including said interface is continuously formed.
4. The semiconductor device of claim 1 , wherein the semiconductor device is fabricated so that the difference in thickness between the P-type part and the N-type part is equal to or smaller than twice the thickness of a metal film formed for forming the metal silicide film.