Semiconductor structure of a high side driver
View Patent ↗A semiconductor structure of a high side driver includes an ion-doped junction. The ion-doped junction includes a substrate and a deep well. The deep well is formed in the substrate and has a first concave structure. The ion-doped junction includes a semiconductor region connected to the first concave structure of the deep well and having substantially the same ion-doping concentration as the substrate.
1. A semiconductor structure of a high side driver, comprising:
an ion-doped junction, comprising:
a substrate;
a deep well, formed in the substrate, wherein the deep well has a first concave structure;
a semiconductor region, located on an upper surface of the substrate and connected to the first concave structure of the deep well, wherein the semiconductor region has substantially the same ion-doping concentration as the substrate; and
a second well, surrounding the semiconductor region and the deep well, wherein the second well has a complementary ion-doped type to the deep well; and
a conductive capacitor structure, formed above the deep well and covering the deep well.
2. The semiconductor structure according to claim 1 , further comprising an oxide layer, formed on the ion-doped junction, wherein the conductive capacitor structure is formed on the oxide layer.
3. The semiconductor structure according to claim 2 , wherein the ion-doped junction further comprises a heavy ion-doped region having the same ion-doped type with the deep well, and the heavy ion-doped region is connected to a highest potential node of the conductive capacitor structure.
4. The semiconductor structure according to claim 2 , wherein the depth of the deep well is from 2 um to 10 um.
5. The semiconductor structure according to claim 2 , further comprising a first dielectric layer formed between the conductive capacitor structure and the oxide layer.
6. The semiconductor structure according to claim 5 , wherein the conductive capacitor structure comprising:
a first metal layer, formed on the first dielectric layer, wherein the first metal layer has a second concave structure corresponding to the first concave structure;
a second dielectric layer, formed on the first metal layer; and
a plurality of separated second metal layers, formed on the second dielectric layer, wherein one of the second metal layers is connected to a high voltage, another one of the second metal layers is connected to a low voltage and each of the second metal layers has a third concave structure corresponding to the second concave structure.
7. The semiconductor structure according to claim 1 , wherein the first concave structure is an L-shaped corner structure.
8. The semiconductor structure according to claim 1 , wherein the substrate is a P-substrate and the deep well is a deep N well.
9. The semiconductor structure according to claim 1 , wherein the doping concentration of the deep well is from 1.7E17 cm-3 to 8.3E18 cm-3.
10. A semiconductor structure of a high side driver, comprising:
an ion-doped junction, comprising:
a substrate;
a deep well, formed in the substrate, wherein the deep well has a concave corner indented toward a central part of the deep well;
a semiconductor region, located on an upper surface of the substrate and connected to the concave corner of the deep well, wherein the semiconductor region has substantially the same ion-doping concentration as the substrate; and
a second well, surrounding the semiconductor region and the deep well, wherein the second well has a complementary ion-doped type to the deep well.