LED Assembly with Vented Circuit Board
A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
1 . A circuit board LED display assembly, comprising:
a plurality of LED modules, each LED module being disposed at a corresponding junction, the junctions being connected to bridges in which adjacent bridges define air vents for allowing air to pass through; and
the bridges and junctions including a multilayered substrate having an external insulating layer and a thermal cooling layer in thermal communication with the LED modules; the external insulating layer having a plurality of fluid openings configured for fluid convective heat transfer with the thermal cooling layer.
2 . The circuit board LED display assembly according claim 1 , the multilayered substrate further comprises a plurality of power layers being in electrical communication with the LED modules.
3 . The circuit board LED display assembly according to claim 1 , wherein the LED modules have a base member disposed on the multilayer substrate and the base member is in thermal communication with the thermal cooling layer.
4 . The circuit board LED display assembly according to claim 3 , wherein the base member includes at least one extension member abutting the thermal cooling layer.
5 . The circuit board LED display assembly according to claim 1 , further comprising a plurality of air holes in close proximity to the LED modules and the air holes extending through the multilayer substrate for allowing air to pass through.
6 . The circuit board LED display assembly according to claim 1 , wherein the LED modules includes a plurality of LEDs and at least one decoder unit for controlling the LEDs.
7 . The circuit board LED display assembly according to claim 6 , wherein the LED modules include a removably mounted dome for enclosing the plurality of LEDs therein and a base member for connecting to the thermal cooling layer.
8 . The circuit board LED display assembly according to claim 1 , wherein the fluid openings are disposed on a sidewall of the multilayered substrate.
9 . The circuit board LED display assembly according to claim 1 , wherein the fluid openings are disposed on a top surface of the multilayered substrate.
10 . The circuit board LED display assembly according to claim 1 , wherein the multilayered substrate includes a first layer of a plurality of electrical conductors in the X-direction and a second layer of a plurality of electrical conductors in the Y-direction; said first and second layers being in electrical communication with the LED modules.